Editor's Blog and Industry Comments
3D printing trials of unmanned aircraft with one-way tickets
22 April, 2014
Engineers at the Advanced Manufacturing Research Centre at the University of Sheffield are working on the prototype of a 3D printed unmanned aerial vehicle. Low production costs might lead to 3D unmanned aircraft that could be disposable and sent on
MEPS: Steep rise in nickel costs boosts stainless steel prices
22 April, 2014
The forecast upturn in demand for stainless steel did not materialise during the first quarter of 2014. As a result, basis figures, net of alloy adjustments, have risen very little, if at all. However, recent increases in nickel costs have lifted
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Featured News
Groundbreaking research into continuous manufacture of composite pipelines
Element Materials Technology : 22 April, 2014  (Company News)
Element Hitchin (UK) has successfully completed a groundbreaking proof-of-concept research project to design and build equipment for the continuous quality control and repairing of reinforced thermoplastic pipes during the manufacturing process. This represents a first of its kind capability for the Oil & Gas sector.
 
Radiation tolerant "cleaning" alga requisitioned to clean up effluent
Institution of Chemical Engineers (IChemE) : 22 April, 2014  (Technical Article)
A radiation tolerant alga capable of living in extreme conditions may soon be used to help clean-up effluent and wastewater produced by nuclear facilities.
 
Dedicated manufacturing unit established for vacuum brazing
Wallwork Heat Treatment : 22 April, 2014  (Company News)
Surface engineering specialist Tecvac has established a dedicated cell for production of complex components by vacuum brazing. The unit is designed to braze ′one-off’ and development components but also has the capacity to produce high volumes of commercial parts using vacuum furnaces of varying size.
 
Conductive Inks: booming to $2.8 billion by 2024
ID TechEx : 22 April, 2014  (Technical Article)
The conductive ink and paste business is segmented, consisting of many emerging and mature markets. In the new report Conductive Ink Markets 2014-2024: Forecasts, Technologies, Players IDTechEx sees the market experiencing 4.5% CAGR over the coming decade, although growth will be unevenly spread with several target markets experiencing rapid growth while others decline. Dr Khasha Ghaffarzadeh, Head of Consulting, IDTechEx, expands.
 
Nanofibres move into the medical field and advanced composites
Nanotechnology Knowledge Transfer Network (NanoKTN) : 22 April, 2014  (Technical Article)
Electrospinning is now established as a commercially viable manufacturing process with nanofibres of a range of different polymers now readily available, either as standard product or as "specials’. Applications for these nanofibres are potentially in many different market areas and it is becoming clear that the greatest added value for electrospun nanofibres can be realised where they are used as part of a composite or in a multi-component construction. This article by Dr Barry Park and Dr Gabriela Juarez Martînez, Theme Managers of NanoKTN, together with Professor Bob Stevens, Professor of Smart Materials and Devices, iSMART Project Director, School of Science and Technology, Clifton Campus, Nottingham Trent University, is based on the talks presented at the event Nanofibres to Nanocomposites held at MediCity in Nottingham on 27 February. This event was co-organised by NanoKTN and Nottingham Trent University.
 
Hybrid adhesive for labelling custom durable goods
Avery Dennison (NL) : 22 April, 2014  (New Product)
Avery Dennison has introduced a hybrid adhesive called S8039 for durable goods labelling. Available via the Mix & Match service, it allows a choice from a wide range of different face-materials and release liners, meeting very specific product application needs. The Avery Dennison Mix & Match service allows a free choice of different facestock materials and release liners and the minimum order quantity is 500m<2>.
 
High performance polyimides for high performance DDR4 memory connectors
DSM Engineering Plastics (Sittard) : 22 April, 2014  (Application Story)
Top electronics companies are choosing DSM's high performance polyamides for the latest generation of synchronous dynamic random-access memory (SDRAM) connectors. These so-called DDR4 connectors demand more from thermoplastics in terms of thermal and mechanical performance. DSM is showing DDR4 connectors in its Stanyl polyamide 46 and Stanyl ForTii polyamide 4T at Chinaplas, which takes place in Shanghai on 23-26 April.
 
Graphene Review: A Future for Electronics Applications
GH Raisoni College of Engineering. : 22 April, 2014  (Technical Article)
Graphene has recently attracted great interest among the researcher in the field of material science and nanotechnology. Some of the unique properties of graphene with new device concepts and nanotechnology can overcome some of the main limitations of traditional radio frequency electronics in terms of maximum frequency, linearity, and power dissipation. A paper published on academia.edu highlights the recent research done on graphene and attempts to discuss the possible use of graphene in future electronics applications.
 
 
 
 
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