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Company Directory
Master Bond
154 Hobart Street
Hackensack
USA
New Jersey 07601
[t] +1 201 343 8983
[f] +1 201 343 2132
Master Bond is a leading manufacturer of high performance adhesives, sealants, coatings, potting and encapsulation compounds and impregnation resins. Our line of products consists of epoxies, polyurethanes, silicones, acrylics, polyamides and latex systems. They also include such specialties as anaerobics and cyanoacrylates. One and two component systems are available. Systems cure at room temperature, exposure to heat and upon exposure to UV light.
Potting compounds for protecting electronic circuits
28 November, 2014
Potting compounds offer protection for electronic circuits. Master Bond has published a white paper covering the properties of the various options available.
Thermally conductive, two-component epoxy passes medical device specifications
20 September, 2014
Master Bond EP21AOLV-2Med meets USP Class VI and ISO 10993-5 specifications for medical device applications. It is thermally conductive and a competent electrical insulator.
Q & A on corrosion-resistant coatings
29 May, 2014
Utsav Shah, Product Development Engineer at Master Bond answers questions about corrosion and corrosion resistant coatings. Shah has a background in Polymer Engineering, having earned a Masters degree in Material Science from University of Southern California.
Space adhesives - low outgassing epoxy survives cryogenic shock
16 March, 2014
Master Bond has introduced a new two component epoxy adhesive/sealant for cryogenic applications. Called EP29LPSP, this compound is able to withstand temperatures as low as 4K. Additionally, it is able to resist cryogenic shocks (room temperature down to liquid helium temperatures in a 5-10 minute time period).
Surface preparation for bonding metals
04 March, 2014
Master Bond manufactures a wide range of adhesives for bonding metals to metals, as well as metals to other substrates. Surface preparation plays a key role to ensuring that good bond strength is achieved. The following techniques are typically used as practices for proper surface preparation:
Non-drip, one component silicone offers high temperature resistance, thermal conductivity and electrical isolation
31 January, 2014
Placing emphasis on convenient handling, Master Bond MasterSil 705TC features a paste consistency that does not require mixing. This single component system sets up in 7 minutes and has a non-corrosive cure at room temperature when exposed to atmospheric humidity.
Toughened two-component epoxy is optically clear and resists thermal cycling
08 December, 2013
Master Bond EP38CL has been developed for bonding, sealing, coating and encapsulation applications that require toughness and durability. With a Shore D hardness exceeding 75, its toughness is a unique property that imparts resistance to rigorous thermal cycling, impact and mechanical shock.
Thermally conductive two-component silicone meets UL 94V-0 spec for flame retardancy
16 September, 2013
In addition to typical silicone properties such as flexibility and high temperature resistance, Master Bond MasterSil 156 passes the rigorous UL 94V-0 tests for flame retardancy. This two part silicone system is addition cured and does not require exposure to air for complete cross-linking. It has a convenient one to one mix ratio by weight and will not outgas while curing.
Quartz-filled two-component epoxy features high temperature and chemical resistance
27 August, 2013
Master Bond Supreme 45HTQ is a thermally stable, two-component, quartz-filled epoxy system. It features exceptional abrasion and chemical resistant properties. It will withstand exposure to petrochemicals, acids, bases and solvents. It retains its performance profile at elevated temperatures up to +450F.
Low viscosity, two-component epoxy has extended working life and low exotherm
03 August, 2013
Suitable for large castings, Master Bond EP21LVSP6 combines a low viscosity and low exotherm with a working life of 3 to 5 hours. It can also be used for bonding, sealing and coating applications in aerospace, electronic, electrical, optical and other specialty industries.
Optically clear, medical grade epoxy features high glass transition temperature
13 July, 2013
Effectively used in medical device manufacturing applications, Master Bond UV10TKMed is a higher viscosity UV system for bonding, sealing and coating that passes USP Class VI testing. It also meets the requirements of ISO 10993-5 for cytotoxicity.
Silver conductive, one-part aqueous-based sodium silicate for EMI/RFI shielding
03 June, 2013
Master Bond MB600S is an aqueous-based sodium silicate formulated for coating applications where electromagnetic interference/radio frequency interference (EMI/RFI) shielding is required.
Flame retardant epoxy for potting and casting is room temperature curing
28 May, 2013
EP21FRNS-2 is a two-component, flame-resistant, epoxy System for potting, encapsulating and casting. It features a non-halogen filler and produces very low smoke levels, meeting the UL94V-0 flame retardant specification. Wide applicability is expected in the computer, aerospace and related industries.
Video File: Addition-cured silicone meets specifications for biocompatibility and cytoxicity
18 May, 2013
Master Bond MasterSil 153Med is a two component, medical grade silicone adhesive that resists temperatures up to 400F. Formulated for medical device applications, MasterSil 153Med passes USP Class VI and ISO 10993-5 testing.
Video File: Two-component room temperature curing epoxy meets UL 94V-0
06 May, 2013
Featuring a non-halogen filler, Master Bond EP21FRNS-2 passes UL 94V-0 testing for flame retardancy in potting, encapsulation and casting applications. It produces very low smoke levels and is well suited for the computer, aerospace and related industries.
Temperature-resistant B-staged adhesive film is thermally conductive, yet electrically insulating
09 April, 2013
In an effort to mitigate the more complicated preparation associated with B-staged epoxies, Master Bond has developed FLM36 for bonding and sealing applications in the aerospace, electronic, opto-electronic and specialty OEM industries. This B-staged film eliminates mixing and measuring and is easy to handle.
Dimensionally stable UV curable system with high glass transition temperature
10 March, 2013
Suitable for high production applications, Master Bond UV25 offers fast fixture times, rapid curing and high temperature resistance. This multifunctional one component UV curable system was developed for bonding, sealing, coating and encapsulation applications. It is widely used in aerospace, fibre-optic, optical, electronic and related industries.
Optically clear, two-component urethane-modified epoxy gel offers dimensional stability
08 February, 2013
Featuring softness and resilience, Master Bond Super Gel 9 is a urethane modified epoxy gel that can be employed in a variety of applications. Some of the most common include the encapsulation of sensitive electronic parts and sealing optical components. This multifunctional system is also widely used in the aerospace, electronic, optical, electro-optical and other specialty industries.
Chemically resistant, high strength two-component epoxy withstands elevated temperatures
18 January, 2013
With the ability to withstand acids, bases and many solvents, Master Bond EP62-1 is primarily used as an adhesive, sealant or coating where the epoxy will be exposed to very harsh conditions. This two part epoxy features thermal stability with a glass transition temperature exceeding 170C.
LED-curable one-part system offers exceptionally fast cure speeds for heat-sensitive substrates
22 October, 2012
Master Bond LED401 is a breakthrough system based on LED technology. This adhesive, sealant, coating and encapsulant cures tack-free upon exposure to a 405 nm wavelength light source, without any oxygen inhibition. Optically clear, it is also safer and easier to handle than similar UV systems as LED lights emit substantially less heat than UV lamps. This makes LED401 a suitable choice for applications involving heat sensitive substrates.
Low Thermal Expansion Epoxy Passes NASA Low Outgassing Tests
20 April, 2011
Formulated with a special blend of polymeric and inorganic materials, Master Bond EP30LTE-LO features unparalleled dimensional stability and sets new standards of performance for bonding, sealing, casting and coating applications in the aerospace, electrical, electronic, chemical, optical, and computer industries.
Epoxy adhesive cures at room temperature, yet withstands cryogenic conditions
25 March, 2011
Polymer System EP37-3FLF is an optically clear, two component epoxy which has exceptional resistance to cryogenic temperatures and severe thermal cycling. Its low exotherm also makes it a superb potting, encapsulating and casting system, especially where wider cross section thicknesses are specified. This combination of properties allows it to cure without stressing delicate electronic components.
Chemically resistant epoxy withstands a year in sulfuric & hydrochloric acid
02 March, 2011
For applications demanding exceptional chemical resistance, especially to acids, fuels, and oils, Master Bond has developed EP21AR. Whether coating, lining, bonding or sealing, this two-component epoxy can withstand harsh, acidic environments, including prolonged immersion in 96-98% sulfuric acid and 36% hydrochloric acid for over a year.
Silver conductive epoxy adhesive seets stringent NASA low outgassing standards
09 February, 2011
The electrically conductive silver-filled epoxy Master Bond EP21TDCS-LO passes ASTM 595 for NASA low outgassing specifications. It is widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries.
High temperature resistant toughened structural adhesive cures at room temperature
21 January, 2011
Formulated for structural applications in extreme environments with temperatures from -80 to +425F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact.
Low viscosity epoxy adhesive for cryogenic applications
12 August, 2010
Master Bond EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is extremely versatile and can be used in a wide variety of cryogenic applications.
Electrically insulating structural adhesive has exceptional strength
20 July, 2010
Polymer System EP31 is a two part epoxy system which is both an outstanding electrical insulator and features extraordinary adhesion to a wide variety of substrates including many metals, plastics, rubbers, ceramics and glass.
One part high strength epoxy with`high thermal conductivity meets NASA low outgassing specifications
08 June, 2010
Master Bond's Supreme 10AOHT-LO is a NASA low outgassing, cryogenically serviceable, one part epoxy system formulated to stand up to impact, thermal shock, vibration and stress fatigue cracking.
Single component snap-cure epoxy has outstanding electrical properties and chemical resistance
06 May, 2010
Master Bond EP17HT-3 is a one part epoxy that sets up in 20 to 30 seconds and snap cures in only 2 to 3 minutes at 250-300F.
Sensor bonding adhesive long lasting in the oil and gas industries Performance
13 April, 2010
Master Bond's stable epoxy compounds for downhole applications.
Metal bonding adhesive can replace rivets and spot welds
24 March, 2010
Master Bond's Supreme 11HT metal adhesive produces bonds with significantly high shear and high peel strengths while offering superior resistance to impact, thermal shock, vibration and fatigue cracking
UV conformal coating enhances electronic circuitry performance
05 February, 2010
A UV curing conformal coating for electronic circuitry and components is designed to restrain the impact of moisture, dust, chemicals, and temperature extremes.
New two component epoxy system for service above 500°F
18 November, 2007
Master Bond Inc. of Hackensack, New Jersey has developed a new two component epoxy system for service above 500
New medium viscosity, optically clear Epoxy System resists up to 400
14 November, 2007
Master Bond Inc., Hackensack, N.J. has recently developed a new medium viscosity, two component epoxy adhesive/sealant, coating and casting compound called EP30HT. It is formulated to cure at room temperature or more rapidly at elevated temperatures. EP30HT features superior dimensional stability, superb optical clarity and high temperature resistance up to 400
New low viscosity, flexible UV curable composition formulated for fast, high performance laminating
17 February, 2007
Master Bond Inc. of Hackensack, New Jersey has developed UV19, a new low viscosity, flexible UV curable composition formulated for fast, high performance laminating, sealing, bonding and casting. It is an optically clear, mobile liquid which cures readily upon exposure to UV light at ambient temperatures to a flexible strong solid with superior mechanical strength properties and excellent adhesion to many different substrates including most plastics and glasses as well as metals. The UV19 system is 100% reactive and does not contain any volatiles. Unlike many other commercially offered UV curing compounds, its cure is not inhibited by air and it exhibits minimal shrinkage when cured. UV19 has excellent resistance to water and many other aggressive chemicals.
10HTFL new one component flexible high performance epoxy resin based adhesive/sealant
16 February, 2007
Master Bond Polymer System Supreme 10HTFL is a new one component flexible high performance epoxy resin based adhesive/sealant with an exceptionally wide service temperature range of -300
New USP class VI approved Epoxy adhesive resists sterilants
15 February, 2007
Master Bond Inc, Hackensack, N.J. has developed EP62-1MED, a new, two component epoxy adhesive system which features outstanding chemical and temperature resistance. This compound is specifically designed to withstand repeated cycles of steam, ethylene oxide, radiation and chemical sterilization. EP62-1MED cures at moderately elevated temperatures (150
New one part UV and heat curable Epoxy System
13 February, 2007
Master Bond Inc., Hackensack, N.J. is pleased to announce the development of a special dual cure (UV/heat curable) epoxy system called UV15DC80. It is designed for bonding, sealing, coating and potting applications. This compound has a low viscosity, is easy to apply and requires no mixing. Environmentally friendly, it is 100% solid and contains no solvents or volatiles. UV15DC80 is not inhibited by oxygen and has low shrinkage upon cure.
New one part silicone elastomer has high transparency to visible light
12 February, 2007
A new one component high performance silicone elastomer compound for bonding, sealing and coating has been developed by Master Bond Inc., Hackensack, N.J. called MasterSil 415. This formulation has high transparency and is particularly well suited for optical and display applications. It cures at ambient temperatures to a flexible, rubbery solid when exposed to atmospheric moisture. It is easy to apply and has a paste consistency. It can be applied on vertical surfaces without sagging or running.
New one component adhesive/sealant resists up to 600
03 September, 2006
Master Bond Inc., Hackensack, N.J. has developed a new toughened one component heat curing epoxy adhesive/sealant, called EP17. This compound has a service operating range of from -300
New one component flexible high performance epoxy resin based adhesive with an exceptionally wide service temperature range
26 August, 2006
Master Bond Polymer System Supreme 10HTFL is a new one component flexible high performance epoxy resin based adhesive/sealant with an exceptionally wide service temperature range of -300
New one component flexible high performance epoxy based adhesive/sealant has long term ambient temperature storage capability
26 August, 2006
Master Bond Polymer System Supreme 10HTFL is a new one component flexible high performance epoxy resin based adhesive/sealant with an exceptionally wide service temperature range of -300
Master Bond Inc., has developed a new toughened one component heat curing epoxy adhesive/sealant
31 July, 2006
Master Bond Inc., Hackensack, N.J. has developed a new toughened one component heat curing epoxy adhesive/sealant, called EP17. This compound has a service operating range of from -300
New high strength one part epoxy adhesive cures at 80 degrees C
20 March, 2006
Master Bond Supreme 3HT-80 is a new one component heat curing epoxy adhesive developed by Master Bond Inc. Supreme 3HT-80 exhibits both high shear and high peel strength. It offers superior resistance to impact, thermal shock, vibration and stress fatigue cracking. This no mix compound has an unlimited working life and cures within 30 minutes at 175 degrees F.
New two component nickel conductive epoxy adhesive
08 February, 2006
Master Bond Inc. of Hackensack, New Jersey has developed a new two component, room temperature curing, nickel filled, electrically conductive epoxy adhesive called EP76M. EP76M has a convenient one to one mix ratio by weight or volume. It has a volume resistivity of 5-10 ohm-cm and excellent low outgassing properties. It has a thermal conductivity of 8-9 BTU/in/ft
USP class VI approved adhesive resists exposure to repeated sterilization
01 August, 2005
Master Bond Inc. of Hackensack, New Jersey has developed a new two component heat cured epoxy adhesive called EP45HT MED. This compound is durable, tough and resistant to exposure to thermal shock and many chemicals. It can withstand long term exposure form -80
USP class VI approved adhesive resists exposure to repeated sterilization
01 August, 2005
Master Bond Inc. of Hackensack, New Jersey has developed a new two component heat cured epoxy adhesive called EP45HT MED. This compound is durable, tough and resistant to exposure to thermal shock and many chemicals. It can withstand long term exposure form -80
Low viscosity UV curable compound designed for high performance laminating, sealing, bonding & coating
18 April, 2005
Master Bond Inc. of Hackensack, New Jersey has developed UV19, a new low viscosity, flexible UV curable composition formulated for fast, high performance laminating, sealing, bonding and casting. It is an optically clear, mobile liquid which cures readily upon exposure to UV light at ambient temperatures to a flexible strong solid with superior mechanical strength properties and excellent adhesion to many different substrates including most plastics and glasses as well as metals. The UV19 system is 100% reactive and does not contain any volatiles. Unlike many other commercially offered UV curing compounds, its cure is not inhibited by air and it exhibits minimal shrinkage when cured. UV19 has excellent resistance to water and many other aggressive chemicals.
A new flexible, low viscosity UV curable compound specially designed for high performance
18 April, 2005
Master Bond Inc. of Hackensack, New Jersey has developed UV19, a new low viscosity, flexible UV curable composition formulated for fast, high performance laminating, sealing, bonding and casting. It is an optically clear, mobile liquid which cures readily upon exposure to UV light at ambient temperatures to a flexible strong solid with superior mechanical strength properties and excellent adhesion to many different substrates including most plastics and glasses as well as metals. The UV19 system is 100% reactive and does not contain any volatiles. Unlike many other commercially offered UV curing compounds, its cure is not inhibited by air and it exhibits minimal shrinkage when cured. UV19 has excellent resistance to water and many other aggressive chemicals.
Silver conductive epoxy adhesive has rapid set up time
04 February, 2005
EP77M-F is a new, two component, silver filled, electrically conductive epoxy adhesive for high performance bonding. This compound has a low volume resistivity of 10-3 ohm-cm. It will set up in 5-10 minutes at room temperature, even when applied in very small amounts. Full cure usually takes 8-12 hours at room temperatures. Electrical conductivity develops rapidly and is first detectable within 30-60 minutes.
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