Electronic Materials |
| |
|
Printed Electronics are being developed by over 3,000 companies, universities and research institutes worldwide. Although a significant percentage of these developers are located in countries such as the USA, Germany, Japan and South Korea, there's a lot of research effort in other countries also, even if the concentration of active companies active is lower. The two examples described below are the CSIRO in Australia and the A*Star-IMRE in Singapore. |
05 September 2010: ID TechEx |
| |
|
The global RFID business has grown about five fold in the last ten years and analyst IDTechEx has detailed reasons for seeing the market grow 4.2 times in value over the next ten years. However, many of the government initiatives that powered past growth are largely completed, such as e-passports and the Chinese National ID card, so where does that future growth come from?
by Dr. Peter Harrop, Chairman, IDTechEx |
05 September 2010: ID TechEx |
| |
|
Indium Corporation announces a joint marketing and technical support agreement for high-temperature Pb-free electronics assembly materials patented and manufactured by Ormet Circuits. |
|
| |
|
The two-shot moulding process produces MIDs from a combination of plateable and non-plateable injection moulded resins. A non-plateable polymer is moulded in the first shot and is then selectively moulded with a second plateable material, leaving specified areas exposed. An etching step then activates the exposed areas of plateable polymer so that those areas can be plated with metal. |
|
| |
|
Strong evidence that magnetic fluctuations are key to a universal mechanism for pairing electrons and enabling resistance-free passage of electric current in high-temperature superconductors. |
|
| |
|
A new material created by research scientists can rapidly shrink or swell to change the colour of light that it scatters. |
|
| |
|
The optimised blend of polymer and organic semiconductors has better performance characteristics than the organic semiconductor alone. |
|
| |
|
IMEC’s associated laboratory at the Ghent University, INTEC, has made the first functional optical links embedded in a flexible substrate. The links include optical waveguides, light sources, and detectors. With this technique, it becomes possible to make foils that sense changes in pressure. Such sensing, skin-like foils could be used for monitoring irregular or moving surfaces, e.g. in robots, pliable machinery, or as an artificial skin. |
|
| |
|
ASML introduced its newest 193nm Step & Scan lithography tool for high-volume production of semiconductor devices at the 100nm technology node. The PAS 5500/1100TM system provides the highest value of ownership for leading-edge IC makers by combining a 0.75 numerical aperture lens, improved leveling performance and industry-leading overlay with an exposure capacity exceeding 90 200mm wafers per hour at a dose of 20 mJ/cm2. |
|
| |
|
ASML Holding NV announced a new lithography system with the highest numerical aperture, 1.2, in the semiconductor industry. The ASML TWINSCAN XT:1700i system is a 193 nm immersion scanner capable of volume chip production at the 45 nm node. |
|
| |
|
ASML Holding NV announced the industry’s first immersion lithography system, the TWINSCAN XT:1250i, a 0.85 NA, 193 nm pre-production lithography scanner that combines the improved depth of focus of immersion tools with the precision of “dry” lithography systems. ASML has already booked a customer order for the XT:1250i with initial delivery set. |
|
| |
|
ASML introduced the industry's first KrF (248nm) Step & Scan 300mm dual stage lithography system capable of 110nm resolution. The TWINSCAN AT:850B(tm) features Carl Zeiss Starlith(tm)850 advanced projection optics with a numerical aperture of 0.80, which is the highest NA available in a KrF system. |
|
| |
|
ASML announces the introduction of dual wafer stage technology for new i-line and deep UV imaging systems, extending the product offerings of its TWINSCANTM 300mm technology platform. This dual wafer stage system optimizes the lithographic processing of 300mm wafers by parallel operation of two independent wafer stages. |
|
| |
|
In a move to eliminate the growing gap between semiconductor design and sub-wavelength manufacturing, ASML MaskTools, a wholly owned subsidiary of ASML, and Mentor Graphics Corporation have signed a collaborative agreement. |
|
| |
|
ASML Holding NV announced that semiconductor R&D consortium SEMATECH has awarded ASML a contract to qualify the imaging performance of advanced logic patterns, metrology structures and defect designs for the 45-nanometer (nm), 32-nm, and 22-nm technology nodes. |
|
| |
|
ASML Holding NV and partners in the semiconductor lithography supply chain provided an update today on their progress towards the commercialization of extreme ultraviolet lithography. |
|
| |
|
ASML Holding NV announced that Hynix Semiconductor Inc., one of the world’s leading memory manufacturers, has standardized on ASML's LithoCruiser software for the company's process development activity. Hynix has purchased multiple licenses of LithoCruiser to perform lithography simulation and optimization for critical layers in all sub-60-nanometer DRAM and flash memory devices. |
|
| |
|
ASML Holding NV introduced its newest TWINSCAN system, an advanced 193-nanometer (nm) exposure system which features imaging, overlay and throughput improvements. |
|
| |
|
ASML Holding NV and Brion Technologies, Inc. announced that they have signed an agreement for ASML to acquire privately held Brion, a leading provider of semiconductor design and wafer manufacturing optimization solutions for advanced lithography. |
|
| |
|
Imagine you are cruising on a ferry across the North Sea between Newcastle and Amsterdam and you realize that you have to call home. Or someone back home has to call you. But you’re hundreds of kilometers from the nearest cellular operator’s service area. So what do you do? What can they do back home? |
|
| |
|
RAD Data Communications, a leading manufacturer of fixed and mobile network access equipment, will exhibit the company's unique portfolio of products supporting cellular backhaul over packet switched networks at the 3GSM World Congress. |
|
| |
|
Island Internet Services, a nationwide Australian Internet Service Provider, has found an innovative, and cost-effective, way to quickly deploy Ethernet services over incumbent carrier Telstra's access network to its own rapidly growing client base. |
|
| |
|
A rising new operator, Erenis, that is hooking up Parisian buildings to provide telephone and Internet access services to customers with limited income, has deployed IPmux TDM over IP gateways from RAD Data Communications to transport voice traffic over an IP Ethernet Metropolitan Area Network. |
|
| |
|
COBEE, the Spanish acronym for Compañía Boliviana de Energía Eléctrica has integrated its SCADA, PLC, data information and telephony transport services by deploying Optimux-XLE1 optical multiplexers manufactured by RAD Data Communications. |
|
| |
|
FCD-155 transports new generation IP/Ethernet services and traditional TDM services using asynchronous tributary modules for both point-to-point and point-to-multipoint networks. The FCD-155 platform has been deployed and benchmarked by several carriers for metro access and premises-based transparent LAN service, Internet access and Ethernet private line applications. RAD is expanding field trials of the system with particular emphasis on the EoS application. |
|
| |
| |
| 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 |
| |
