Electronic Materials |
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The two-shot moulding process produces MIDs from a combination of plateable and non-plateable injection moulded resins. A non-plateable polymer is moulded in the first shot and is then selectively moulded with a second plateable material, leaving specified areas exposed. An etching step then activates the exposed areas of plateable polymer so that those areas can be plated with metal. |
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Strong evidence that magnetic fluctuations are key to a universal mechanism for pairing electrons and enabling resistance-free passage of electric current in high-temperature superconductors. |
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A new material created by research scientists can rapidly shrink or swell to change the colour of light that it scatters. |
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The optimised blend of polymer and organic semiconductors has better performance characteristics than the organic semiconductor alone. |
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IMEC’s associated laboratory at the Ghent University, INTEC, has made the first functional optical links embedded in a flexible substrate. The links include optical waveguides, light sources, and detectors. With this technique, it becomes possible to make foils that sense changes in pressure. Such sensing, skin-like foils could be used for monitoring irregular or moving surfaces, e.g. in robots, pliable machinery, or as an artificial skin. |
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ASML introduced its newest 193nm Step & Scan lithography tool for high-volume production of semiconductor devices at the 100nm technology node. The PAS 5500/1100TM system provides the highest value of ownership for leading-edge IC makers by combining a 0.75 numerical aperture lens, improved leveling performance and industry-leading overlay with an exposure capacity exceeding 90 200mm wafers per hour at a dose of 20 mJ/cm2. |
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ASML Holding NV announced a new lithography system with the highest numerical aperture, 1.2, in the semiconductor industry. The ASML TWINSCAN XT:1700i system is a 193 nm immersion scanner capable of volume chip production at the 45 nm node. |
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ASML Holding NV announced the industry’s first immersion lithography system, the TWINSCAN XT:1250i, a 0.85 NA, 193 nm pre-production lithography scanner that combines the improved depth of focus of immersion tools with the precision of “dry” lithography systems. ASML has already booked a customer order for the XT:1250i with initial delivery set. |
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ASML introduced the industry's first KrF (248nm) Step & Scan 300mm dual stage lithography system capable of 110nm resolution. The TWINSCAN AT:850B(tm) features Carl Zeiss Starlith(tm)850 advanced projection optics with a numerical aperture of 0.80, which is the highest NA available in a KrF system. |
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ASML announces the introduction of dual wafer stage technology for new i-line and deep UV imaging systems, extending the product offerings of its TWINSCANTM 300mm technology platform. This dual wafer stage system optimizes the lithographic processing of 300mm wafers by parallel operation of two independent wafer stages. |
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In a move to eliminate the growing gap between semiconductor design and sub-wavelength manufacturing, ASML MaskTools, a wholly owned subsidiary of ASML, and Mentor Graphics Corporation have signed a collaborative agreement. |
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ASML Holding NV announced that semiconductor R&D consortium SEMATECH has awarded ASML a contract to qualify the imaging performance of advanced logic patterns, metrology structures and defect designs for the 45-nanometer (nm), 32-nm, and 22-nm technology nodes. |
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ASML Holding NV and partners in the semiconductor lithography supply chain provided an update today on their progress towards the commercialization of extreme ultraviolet lithography. |
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ASML Holding NV announced that Hynix Semiconductor Inc., one of the world’s leading memory manufacturers, has standardized on ASML's LithoCruiser software for the company's process development activity. Hynix has purchased multiple licenses of LithoCruiser to perform lithography simulation and optimization for critical layers in all sub-60-nanometer DRAM and flash memory devices. |
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ASML Holding NV introduced its newest TWINSCAN system, an advanced 193-nanometer (nm) exposure system which features imaging, overlay and throughput improvements. |
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ASML Holding NV and Brion Technologies, Inc. announced that they have signed an agreement for ASML to acquire privately held Brion, a leading provider of semiconductor design and wafer manufacturing optimization solutions for advanced lithography. |
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Imagine you are cruising on a ferry across the North Sea between Newcastle and Amsterdam and you realize that you have to call home. Or someone back home has to call you. But you’re hundreds of kilometers from the nearest cellular operator’s service area. So what do you do? What can they do back home? |
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RAD Data Communications, a leading manufacturer of fixed and mobile network access equipment, will exhibit the company's unique portfolio of products supporting cellular backhaul over packet switched networks at the 3GSM World Congress. |
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Island Internet Services, a nationwide Australian Internet Service Provider, has found an innovative, and cost-effective, way to quickly deploy Ethernet services over incumbent carrier Telstra's access network to its own rapidly growing client base. |
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A rising new operator, Erenis, that is hooking up Parisian buildings to provide telephone and Internet access services to customers with limited income, has deployed IPmux TDM over IP gateways from RAD Data Communications to transport voice traffic over an IP Ethernet Metropolitan Area Network. |
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COBEE, the Spanish acronym for Compañía Boliviana de Energía Eléctrica has integrated its SCADA, PLC, data information and telephony transport services by deploying Optimux-XLE1 optical multiplexers manufactured by RAD Data Communications. |
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FCD-155 transports new generation IP/Ethernet services and traditional TDM services using asynchronous tributary modules for both point-to-point and point-to-multipoint networks. The FCD-155 platform has been deployed and benchmarked by several carriers for metro access and premises-based transparent LAN service, Internet access and Ethernet private line applications. RAD is expanding field trials of the system with particular emphasis on the EoS application. |
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A leading provider of commercial-grade last-mile broadband Ethernet access for HFC systems, Narad Networks, has partnered with RAD Data Communications to incorporate RAD's industry-leading pseudo-wire circuit emulation technology into the NARAD Broadband Interface Unit to provide cable MSOs with a single-box solution delivering T1/E1 plus Ethernet over HFC. |
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RAD Data Communications, the industry leader in legacy-over-packet switched networks, sees a growing trend in Russia towards pseudo-wire circuit emulation solutions over IP, Ethernet and MPLS backbones. |
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RAD has announced that it has become a founding partner in Panlab, the Pan-European Laboratory for Next Generation Networks and Services. The EU-funded research project was formed to enable laboratories across Europe to collaborate in the area of next generation telecommunications networks and services, in order to improve and accelerate infrastructure and service testing. |
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