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News

10HTFL new one component flexible high performance epoxy resin based adhesive/sealant

Master Bond : 16 February, 2007  (New Product)
Master Bond Polymer System Supreme 10HTFL is a new one component flexible high performance epoxy resin based adhesive/sealant with an exceptionally wide service temperature range of -300
Master Bond Polymer System Supreme 10HTFL is a new one component flexible high performance epoxy resin based adhesive/sealant with an exceptionally wide service temperature range of -300F to +300F. It cures readily to a tough, strong flexible thermoset polymer at temperatures of 250-300F and above. Unlike other commercially available flexible one part epoxy adhesive sealants, it features extended ambient temperature storage capability and does not require refrigeration for extended storage before use. Master Bond Polymer System Supreme 10HTFL features high physical strength properties and excellent adhesion to a wide range of both metallic and nonmetallic substrates even upon prolonged exposure to hostile environmental conditions. Adhesive and sealing properties to aluminum, steel and other metals, as well as fiber reinforced composites, most plastics, ceramics, glass, wood, etc. are remarkably high. Tensile lap shear strengths of more than 2000 psi and T-peels in excess of 60 pli are obtained for aluminum bonding.

Master Bond Polymer System Supreme 10HTFL has remarkable high resistance to severe thermal and mechanical shock and vibration. Pertinent physical strength properties including flexibility are retained when Supreme 10HTFL bonded assemblies are subjected to the most demanding service conditions. The performance properties of this one component flexible epoxy compound are particularly impressive when bonding substrates with wide differences in their thermal expansion coefficients. Supreme 10HTFL has superior chemical resistance to water, salts, oils, fuels and many organic solvents. It is an excellent electrical insulator. Master Bond Polymer System Supreme 10HTFL does not require any mixing prior to use and provides a simple, cost effective solution to many difficult assembly problems which call for convenient fast processing along with high performance over a wide service temperature range.
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