Free Newsletter
Register for our Free Newsletters
Newsletter
Zones
Advanced Composites
LeftNav
Aerospace
LeftNav
Amorphous Metal Structures
LeftNav
Analysis and Simulation
LeftNav
Asbestos and Substitutes
LeftNav
Associations, Research Organisations and Universities
LeftNav
Automation Equipment
LeftNav
Automotive
LeftNav
Biomaterials
LeftNav
Building Materials
LeftNav
Bulk Handling and Storage
LeftNav
CFCs and Substitutes
LeftNav
Company
LeftNav
Components
LeftNav
Consultancy
LeftNav
View All
Other Carouselweb publications
Carousel Web
Defense File
New Materials
Pro Health Zone
Pro Manufacturing Zone
Pro Security Zone
Web Lec
Pro Engineering Zone
 
 
 
News

Microsemi to lead ELCOSINT team to develop material for high-temperature electronics

Microsemi : 03 March, 2013  (Company News)
Microsemi Corporation has been elected to lead the Electronic Component Sintered Interconnections (ELCOSINT) industry team in developing novel polymeric, sintered interconnection materials to replace high lead (Pb) content materials and further increase the operating temperature of electronic assemblies.
Microsemi to lead ELCOSINT team to develop material for high-temperature electronics

These materials will be suitable for components subjected to extremely high operating temperatures of 250C or more, which often occur in market sectors such as aerospace and downhole drilling.

The three-year ELCOSINT project is partially funded by the Technology Strategy Board, an executive non-departmental public body established by the United Kingdom government to stimulate technology-enabled innovation. Microsemi will collaborate on the project with the UK's National Physical Laboratory, a world-leading center of excellence in developing and applying the most accurate measurement standards, science and technology available; and Gwent Electronic Materials, a supplier of sophisticated and cost-effective electronics materials.

The multi-disciplinary ELCOSINT project team will develop the materials and manufacturing process for electronic component interconnection using nano-silver based materials to form joints between components and substrates. The technology will be compatible with standard microelectronics manufacturing processes, and replacing high-lead solder with nano-silver based materials will enable improved performance in harsh environments. It is also more environmentally friendly.

A high temperature sensor amplifier demonstrator will be designed and produced that will allow the characterisation, assessment and qualification of the developments to enable rapid production of reliable, robust electronic systems.

Bookmark and Share
 
Home I Editor's Blog I News by Zone I News by Date I News by Category I Special Reports I Directory I Events I Advertise I Submit Your News I About Us I Guides
 
   © 2012 NewMaterials.com
Netgains Logo