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News

Rapid curing epoxy adhesive has high flexibility

Master Bond : 12 June, 2003  (New Product)
Master Bond EP51FL is a new two component, highly flexible epoxy resin system developed by Master Bond Inc., Hackensack, N.J. for high performance bonding. EP51FL has a 1 to 1 mix ratio, weight or volume. It cures rapidly at room temperature and has a setup time of 30-40 minutes. Cure speeds can be accelerated by the use of heat. It is a 100% reactive system and no solvents or volatiles are emitted during cure.
Master Bond EP51FL is a new two component, highly flexible epoxy resin system developed by Master Bond Inc., Hackensack, N.J. for high performance bonding. EP51FL has a 1 to 1 mix ratio, weight or volume. It cures rapidly at room temperature and has a setup time of 30-40 minutes. Cure speeds can be accelerated by the use of heat. It is a 100% reactive system and no solvents or volatiles are emitted during cure.

Master Bond EP51FL has excellent bond strength to many different substrates including metals, glass, ceramics, wood, various rubbers and most plastics. The cured compound exhibits a remarkably high peel strength of more than 25 pli along with an elongation of >125%. It has superb electrical insulation properties and outstanding resistance to many chemicals. Particularly noteworthy is its ability to withstand thermal and mechanical shocks.

EP51FL has a service operating temperature range of 4K to 250F. It is recommended for use in cryogenic applications. It has a Shore D hardness of 12-15 and a Shore A hardness of 55-60. EP51FL exhibits a tensile strength of 1,150 psi.

Master Bond EP51FL has a mixed viscosity of 70,000-80,000 cps and is easy to apply. A paste version called EP51FLND is also available when a 'non-drip' system is required. EP51FL is available for use in pint, quart, gallon and 5 gallon kits. It can also be obtained in syringe and gun applicators.
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