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News

Vishay introduces first silicon-based, surface-mount RF capacitor in 0603 case size capacitor

Vishay Electronic : 17 September, 2004  (New Product)
Vishay Intertechnology, Inc. today announced the release of the industry's first silicon-based surface-mount RF capacitor available in the 0603 case size. Based on a proprietary semiconductor process developed by Vishay, the new capacitor's construction reduces parasitic inductance while bringing self-resonant frequency values to frequencies two to three times higher than conventional RF capacitors.
Vishay Intertechnology, Inc. today announced the release of the industry's first silicon-based surface-mount RF capacitor available in the 0603 case size. Based on a proprietary semiconductor process developed by Vishay, the new capacitor's construction reduces parasitic inductance while bringing self-resonant frequency values to frequencies two to three times higher than conventional RF capacitors.

The high-performance, high-precision HPC0603A features SRF values as high as 13 GHz over a broad capacitance range from 3.3 pF to 560 pF. The E12 values available in this range provide extremely stable operation over a wide range of frequencies from 1 MHz to several GHz. Parasitic inductance is a low 0.046 nH. HPC0603A devices that offer E24 values are scheduled for release in the near future.

Vishay's new capacitor features high Q factors up to 4157, tolerances of 1% or 0.05 pF, and low ESR values. The HPC0603A measures 0.063 in. by 0.031 in. [1.60 mm by 0.80 mm] with a 0.022 in. [0.56 mm] height profile. Voltage options of 6 V, 10 V, 16 V, and 25 V are available.

The HPC0603A's high capacitance range and relatively compact package enable increases in circuit Q, transmission range, and reliability. HPC devices' unique construction reduces parasitics by shortening interconnecting traces on PCBs and improves circuit performance by decreasing the distance between components.

This innovative design brings the new capacitor's SRF frequencies to new highs, enhancing performance and transmission/reception quality during operation at high frequencies. As a result, designers of wireless communications devices such as mobile and cordless phones, GPS systems, VCOs, filter and matching networks, RF modules, and base stations can implement HPC devices to reduce product size - simplifying design and reducing the number of components on the PCB - without sacrificing electrical performance.

Samples of the HPC0603A are available now, with lead times of up to 10 weeks for production quantities.
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