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News

Vishay's new FunctionPAK DC/DC converter offers power density upwards of 570 W per cubic inch

Vishay Electronic : 21 January, 2005  (New Product)
Vishay Intertechnology, Inc. today announced the release of a new fully integrated dc-to-dc buck converter that delivers power density of more than 570 W per cubic inch in a 20-port, surface-mount BGA package with an area of 0.58 in. by 0.48 in. 14.7 mm by 12.2 mm and a low maximum height profile of 0.126 in. 3.2 mm.
Delivering the greatest power density for this compact package size, the new FX5545G108 FunctionPAK device converts 2.5-V to 6-V inputs to an output voltage range of 0.9 V to 4.5 V with efficiency up to 95%. The FX5545G108 is rated for maximum current of 4 A and for output power of 15 W, with a 1-A shutdown current.

The new converter is designed to adjust and stabilize the input power in point of load applications to a wide variety of semiconductor devices such as FPGAs, microprocessors, DSPs, and DDR-SDRAMs. It also may be used to stabilize, filter, reduce ripple, and shift dc voltage levels - or stabilize battery voltage outputs at a specific lower voltage level - in virtually any end product, including amplifiers, VoIP platforms, routers, professional digital cameras, portable computers, and battery backup systems.

Like other devices in Vishay's FunctionPAK family of single-package, fully integrated dc-to-dc converters, the FX5545G108 requires no external components to provide a complete solution. Programmable PWM/PSM controls ensure ultra-high efficiency, with the converter operating in synchronous rectified PWM mode under full load and shifting into externally controlled pulse-skipping mode (PSM) under light load conditions.

With 100% duty cycle control for PSM operation, the converter acts much like a saturated linear regulator to extract every bit of power from single-cell Li+ or triple-cell NiCd and NiMH battery packs and thus delivers the highest potential output voltage. The FunctionPAK device is compatible with a variety of battery configurations and chemistries, including NiCd, NiMH, and Li+.

FunctionPAK converters feature a select combination of primary and secondary power MOSFETs, a controller IC, and up to 18 passive components in one package, taking up significantly less board space than even the tightest discrete layout while delivering efficiency up to 95%.

For maximum reliability, the BGA package for FunctionPAK is rated for the full industrial temperature range of −40 C to +85 C and specified for military operating temperatures, shock levels, and moisture resistance.

Samples and production quantities of the FX5545G108 converter are available now, with lead times of eight weeks for larger orders.
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