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DEMONSTRATES STRONG COMMITMENT TO DEVELOPING & MANUFACTURING SIC & GAN MATERIALS & SERVICE SOLUTIONS
Dow Corning Corp. is pleased to announce the formation of a new business serving the wide band gap semiconductor industry. The business is founded on an expertise developed from years of in-house and academic research investments, plus the recent acquisitions of business and technology assets in bulk Silicon Carbide, SiC thin film technology, and Gallium Nitride thin film technology. Dow Corning Compound Semiconductor Solutions is establishing this business to take full advantage of the synergies with our electronics, microelectronics and polycrystalline silicon materials businesses, and our state-of-the-art research photonics and electronics materials programs. “We are very excited about the market potentials, and Dow Corning’s future in this business,” said Robert Johns, Global Director of Compound Semiconductor Solutions. “We will be locating our business in Midland, Michigan, close to Dow Corning’s critical mass of technical capabilities, research and development assets, and strong manufacturing disciplines. Consolidating our operations will give us synergies to accelerate our implementation, and achieve world-class quality material specifications and economies of scale,” he said. “Dow Corning will optimize its strong technical and market leadership positions in semiconductor grade polycrystalline silicon, integrated circuit fabrication materials technology, and packaging materials and services to meet the needs of customers. We exist to help ensure SiC and GaN device manufacturers achieve success by partnering with them to provide capabilities and resources that no other supplier can offer,” said Johns
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