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NEW SL MATERIAL & SL ADHESIVES LAUNCHED BY RENSHAPE® SOLUTIONS
31 August 2003 - Huntsman Advanced Materials
| A new thermoplastic-like stereolithography (SL) photopolymer, RenShape SL 5260 and a range of SL adhesives – RenShape SL Bond – have been launched by RenShape Solutions, part of Huntsman Advanced Materials. |
RenShape SL 5260 is formulated for use on SLA 250 He-Cd platforms and produces
durable, opaque white prototypes and parts with an ABS thermoplastic-like surface. It has a rigid flexural modulus of 2,400MPa and an elongation of 12% together with good accuracy and fast processing speed. This new material, along with ABS-like RenShape SL 7560 and the clear SL 7565
photopolymers formulated for use on SLA 7000 platforms, enables customers to broaden their capabilities for the production of stereolithography-generated parts. For example, service bureaux can now use SL materials rather than conventional
polyurethanes cast in RTV silicone rubber moulds to produce accurate and durable
functional prototypes that simulate the performance of engineering thermoplastics. They can also be used to make highly specialised short run production parts such as custom moulded hearing aid shells. In addition to this new SL material, RenShape Solutions is also launching a range of
adhesives specially designed for filling and bonding SL models and prototypes.
RenShape SL Bond 110 has an easy-to-apply low viscosity level; SL Bond 120 is a
standard-viscosity material while SL Bond 130 is thixotropic for good sag resistance onv ertical surfaces. All SL Bond adhesives are packed in convenient 10ml syringes for easy, waste-free
dispensing.
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