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ARALDITE® HELPS TO PRODUCE PRINTED CIRCUIT BOARDS
31 October 2001 - Huntsman Araldite
| The absolute precision necessary in the production of printed circuit boards for the
electronics industry has led Alpha Fry Technologies Ltd of East Kilbride to turn to
Araldite 2014 from Vantico’s Araldite 2000 series of structural adhesives. |
The adhesive is used to make stencils for the application of solder paste to the printed circuit boards. This further demonstrates the wide variety of applications and substrates which are suitable for bonding with adhesives from the Araldite 2000 series. For production, a thin polyester mesh is tensioned over an aluminium frame. While
under tension, the two-component epoxy adhesive is applied, with the help of a
mixing/dispensing machine, around the outer rim of the aluminium frame, and
through the polyester mesh. After curing, the polyester mesh is firmly bonded to the aluminium frame. In a further operation, Araldite 2014 is used to bond a thin
stainless steel sheet to the polyester mesh. When this has cured, the stainless
steel sheet is laser-cut to a highly accurate pre-determined pattern and used as a
stencil for the application of solder paste to the printed circuit boards. Donald Corlett, Operations Manager of Alpha Fry, comments: “Since incorporating
Araldite 2014 into our production we have seen improvements in the performance
of our stencil manufacturing operation in 2 key areas. We now have a stencil with
even greater resistance to the chemical environments encountered during our
customer’s cleaning process. We have also been able to reduce our waste costs
through using automated mix/dispense systems compatible with Araldite 2014,
resulting in a better end product at a lower manufactured cost. “ Araldite 2014 is a two-component, room temperature curing, thixotropic epoxy
paste adhesive of high strength and toughness, with good environmental and
excellent chemical resistance. Used for bonding of metals, electronic components,
GRP structures and many other items where a higher than normal temperature or
more aggressive environment is to be encountered in service. The low out gassing
makes this product suitable for specialist electronic telecommunication and
aerospace applications.
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