THERMAL CONDUCTIVE ADHESIVE HAS CONVENIENT ONE TO ONE MIX RATIO

Main Menu | News By Date | News By Supplier | News By Category | About Us

THERMAL CONDUCTIVE ADHESIVE HAS CONVENIENT ONE TO ONE MIX RATIO
02 February 2004 - Master Bond

Master Bond EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive with a forgiving 1 to 1 mix ratio by weight or volume. Developed by Master Bond Inc., Hackensack, N.J. this compound is extremely versatile and will adhere well to variety of similar and dissimilar substrates. It has a low coefficient of expansion, low shrinkage and superb dimensional stability. It also exhibits superior durability and chemical resistance.

EP21AO is easy to apply and is a self leveling paste. It is 100% reactive and does not contain any solvents or volatiles. It has a thermal conductivity of 10BTU/in/ft²/hr/°F and a dielectric strength of >400 volts/mil. Its volume resistivity is >10¹³ ohm cm. EP21AO has a Shore D hardness of >85 and a tensile strength of 5,000psi. Service operating temperature range is -60°F to +250°F.

Master Bond EP21AO is available for use in pint, quart, gallon and 5 gallon container kits.

http://www.masterbond.com

About: Master Bond
Master Bond is a leading manufacturer of high performance adhesives, sealants, coatings, potting and encapsulation compounds and impregnation resins. Our line of products consists of epoxies, polyurethanes, silicones, acrylics, polyamides and latex systems. They also include such specialties as anaerobics and cyanoacrylates. One and two component systems are available. Systems cure at room temperature, exposure to heat and upon exposure to UV light.

More News:
  • For February 2004
  • From Master Bond
  • For Adhesives