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ROHM & HAAS ELECTRONIC MATERIALS INTRODUCES COPPER ADDITIVES TARGETED AT SUB-65 NM NODE MEMORY
Rohm and Haas Electronic Materials, Microelectronic Technologies, announced the development of its new UltrafillTM 4000 series of levelers and suppressors targeted at the sub-65 nm node for interconnect metallization. Rohm and Haas Electronic Materials has been a leading innovator of metallization products for the electronics industry for decades. Recently, its Microelectronic's researchers successfully optimized copper plating additives, allowing customers to "dial-in" specific amounts of dopants into ultra pure copper films. This exclusive feature of the Ultrafill L-4000 series of levelers enables improved Via Stress Migration results. "Our new levelers allow customers to precisely 'tune' the copper morphology, bringing a higher degree of accuracy and capability to advanced processing," said Robert Mikkola, Copper program manager for Microelectronic Technologies. "And in the suppressor area, our new family of products features superior wetting capabilities that lead to improved gap filling on thin copper seed layers, delivering enhanced reliability for both logic and memory customers," said Mikkola. The Ultrafill L-4000 series of levelers and suppressors were developed over the past two years in conjunction with major copper tool suppliers and direct interaction with IC customers. They were designed to flex the existing copper platform and to provide optimal performance in the extremely demanding sub-65 nm node. "These materials will provide our customers with the technical solutions they require for sub-65 nm devices" said Dr. Yi Hyon Paik, president of Microelectronic Technologies. "We are very excited to offer these new products not only for our Logic customers, but for Memory customers as they adopt copper in their advanced devices," Paik said.
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