NEW SERIES OF NON-ACIDIC BARRIER SLURRIES OPTIMIZED FOR CHEMICAL MECHANICAL PLANARIZATION

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NEW SERIES OF NON-ACIDIC BARRIER SLURRIES OPTIMIZED FOR CHEMICAL MECHANICAL PLANARIZATION
13 September 2004 - Rohm & Haas Co

Rohm and Haas Electronic Materials CMP Technologies, introduced a new series of non-acidic barrier slurries optimized for chemical mechanical planarization of 90nm low-k semiconductor devices. The LK Series barrier slurries accommodate a wide range of integration schemes and offer superior defectivity performance and flexibility. These slurries are currently being qualified and tested at multiple customer facilities, including logic device manufacturers.

Comprised of LK301 and LK309 Barrier Slurries, the LK Series is the next generation beyond CUS1351 Slurry, a barrier slurry from Rohm and Haas Electronic Materials currently used in high-volume semiconductor production. Both products in the LK Series offer superior defectivity performance and are distinguished by their selectivity performance, enabling end-users to choose the product best suited for the specific requirements of their integration scheme. The non-selective LK301 Barrier Slurry is ideal for applications requiring incoming topography correction with low to moderate ILD loss. The more selective LK309 Barrier Slurry is designed to clear TEOS or FSG capping layers and stop on CDO films, while maintaining incoming metal thickness.

"With the LK Series, we provide manufacturers with the flexibility to process multiple film stacks in order to accommodate low-k dielectrics as well as back integration into TEOS and FSG integration schemes," said Rich Baker, vice president of slurry technology for Rohm and Haas Electronic Materials CMP Technologies. "Our LK Series exhibits high barrier removal rates and appropriate selectivities at lower pressure and stress than other slurries currently on the market."

The LK Series slurries provide tantalum nitride removal rates of greater than 700 angstroms per minute at 2psi and are compatible with both the IC1000 and Politex pad platforms. Internal testing and end-user feedback have confirmed the consistency and repeatable performance of the LK Series slurries out to 14 days of dynamic pot life.

The LK Series barrier slurries are produced in the Rohm and Haas Electronic Materials slurry manufacturing facility in Newark, Delaware. This state-of-the-art facility is currently capable of supplying more than 3 million gallons of slurries a year.

Rohm and Haas Electronic Materials CMP Technologies (formerly Rodel) is a leader and innovator in polishing technology for the global semiconductor industry and has been a key supplier to the industry since 1969. CMP Technologies' products include polishing pads, conditioners and slurries. The CMP Technologies business is headquartered in Phoenix, Arizona, and maintains operations throughout the world, including manufacturing facilities in Newark, Delaware and in the Mie and Nara prefectures in Japan.

IC1000 and Politex are trademarks of Rohm and Haas Company or its affiliates.

http://www.rohmhaas.com/

About: Rohm & Haas Co
Rohm & Haas Co is a worldwide producer of speciality materials, with more than 100 plants and research facilities in 27 countries and company sales of approximately US$7 billion in 2004.

The company's Adhesives and Sealants business, with annual sales of US$632 million, is a supplier of formulated adhesives, coatings and polymers for adhesives and sealants. It serves the packaging, converting, transportation, structural, construction and pressure-sensitive adhesives industries.

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