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DUPONT ENGINEERING HAS DEVELOPED NEW GRADES OF DUPONT ZENITE LCP LIQUID CRYSTAL POLYMER
Improved flow for complex, thin-wall components. Two new grades of Zenite LCP deliver even better flow properties than typical LCPs along with other desirable property combinations required for connectors and other board-mounted electronic components. One grade, Zenite 7244, combines low warp with very high flow. The other, Zenite 7140X, is well-suited for board assembly processes using lead-free solder. Its heat deflection temperature is 300ºC, and it has good knit-line strength and an excellent over-all balance of properties. When assembly temperatures soar. New Zenite 9140HT can withstand higher assembly temperatures than most LCPs, yet recommended molding (melt) temperatures are moderate, only 10 to 15ºC above standard LCPs. With a heat deflection temperature of 356ºC, the new resin can withstand gold eutectic solder assembly and the elevated service temperatures sometimes required for coil bobbins or lamp sockets. Improves plating productivity. New Zenite ZE55801 is internally pre-catalyzed, which saves steps in the plating process. Its generally good plating performance also makes for high productivity. It is well-suited for molded interconnects requiring plated-on circuitry and for connectors or other components plated for shielding purposes. Meeting flame-retardant challenges without halogen. New DuPont Zytel HTNFR52G30NH can make connectors, relays and other parts compatible with emerging recycling programs for discarded electronic products. It has outstanding high-temperature capabilities, excellent tracking resistance (>600V CTI) and a V-0 UL94 flammability classification. The resin can be molded in water-controlled tooling. (Note to editors: see separate release on this material).
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