INITIATIVE AND ASML CONFIRM MANUFACTURABILITY OF X ARCHITECTURE
22 April 2002 - ASML Netherlands B.V.

ASML, one of the world's leading providers of advanced technology systems for the semiconductor industry, announced that it had simulated lithography performance of 0.18-micron X Architecture design data and successfully completed proof-of-concept wafer exposures of diagonally oriented 0.25-micron interconnect structures based on the 0.18-micron design rules. These first-ever wafer results indicate that interconnect layers can be successfully made using the X Architecture approach and mark a milestone in demonstrating the ability to manufacture X Architecture interconnect designs.

ASML's experiments, sponsored by the X Initiative and its members, employed X Architecture design data provided by Simplex Solutions, Inc., and photomasks produced by Dai Nippon Printing. Simulation results-determined through the use of ASML's MaskTools LithoCruiser(tm) software-confirm that existing mask data automation and simulation software can be successfully applied to X Architecture design data to optimize lithographic wafer production results. The interconnect layers were exposed using an ASML PAS 5500/750(tm) DUV step and scan tool.

"Lithography is an especially critical part of the semiconductor manufacturing chain, particularly since the advent of the sub-wavelength era. So naturally, as with any new chip architecture, there have been questions about the impact of the X Architecture on lithography," said Risto Puhakka, vice president at VLSI Research. "The results of ASML's experiments using current-generation equipment demonstrate that X Architecture designs are both production-worthy and manufacturable."

"We are pleased to have played a role in demonstrating the manufacturability of the revolutionary X Architecture," said Bill Arnold, chief executive scientist and vice president technology development center for ASML. "We can see the potential benefits of using this approach on non-minimum-resolution interconnect layers, and with our breadth of technology and experience, we are able to provide both mask enhancement and patterning technology to meet the needs of current X Architecture requirements."

"ASML's membership brings the critical wafer lithography steps into the X Initiative, heralding a new phase in solidifying supply-chain adoption," said Jan Willis, vice president of business development at Simplex and X Initiative steering group facilitator. "Because the fundamental mission of the X Initiative is to accelerate the availability and fabrication of the X Architecture, the delivery of cost-effective X Architecture masks and wafers is essential to our success. Since ASML was able to use existing equipment and processes in their testing, their positive results represent a significant step forward in accomplishing the X Initiative's goals."

Anyone interested in learning more about the X Initiative and the aforementioned results is invited to attend an X Initiative Open Forum seminar on Tuesday, May 21 from 12:00 to 2:00 p.m. PDT at the Fairmont Hotel in San Jose, Calif. The seminar will feature ASML's Adolph Hunter, manager strategic partnerships. Those interested may RSVP at www.xinitiative.org, where extensive information on the X Architecture is also available.

http://www.asml.com

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