SYSTEM PROVIDES INDUSTRY-LEADING PRODUCTIVITY FOR 100NM VOLUME MANUFACTURING ON 300MM WAFERS
21 December 2001 - ASML Netherlands B.V.

ASML today announced the first shipment of its dual-stage ArF (193nm) lithography system for 300mm wafer processing. The system was shipped this month to a leading global semiconductor manufacturer. Introduced in July 2001, the AT:1100(tm) system builds upon ASML's successful 300mm TWINSCAN(tm) dual-stage platform and was developed as the industry's first high-productivity ArF lithography system for volume production applications of 300mm wafers at the 100nm technology node.

Doug Dunn, ASML's president and CEO, said: "This TWINSCAN AT:1100 shipment means we are first to market with leading-edge 0.10 micron ArF imaging technology. It marks ASML's commitment to delivering new product to customers well ahead of our competitors."

The AT:1100 incorporates a Carl Zeiss ArF StarLith(tm) 1100 lens, which features the highest numerical aperture (0.75) available in an ArF lens. The StarLith's improved aberration control reduces influence on critical lithography structures, which enhances the imaging performance.

The AT:1100 is designed for seamless mix-and-match operation with ASML's TWINSCAN product family, including the AT:850, a 248nm deep UV system, and the AT:400, an i-line system, thereby ensuring the lowest cost per level even with advanced process technologies. The TWINSCAN platform allows either left or right hand configuration for optimum fab layout with track processing equipment and 300mm automated materials handling systems. The modular design reduces system installation time for faster fab ramp up and time to market for advanced chips.

http://www.asml.com

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