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ROGERS CORP. TO PRESENT RO4450B-DX BONDPLY AT EUMW
23 November 2006 - Rogers Corporation
| Rogers Corporation will be introducing its new RO4450B-dx Bondply, a high fill/flow version of the industry standard RO4450B High Frequency Circuit Material, at this year’s European Microwave Week. |
Rogers Corporation will be introducing its new RO4450B-dx Bondply, a high fill/flow version of the industry standard RO4450B High Frequency Circuit Material, at this year’s European Microwave Week. RO4450B circuit material is a glass-reinforced hydrocarbon/ceramic thermoset bondply designed for performance-sensitive, multilayer printed circuit boards. These bondplys are designed to offer superior high frequency performance and low cost circuit fabrication. The result is a low loss material, which can be fabricated using standard epoxy/glass (FR4) processes. The new RO4450B-dx is a high fill/flow version of the RO4450B bondply. It is designed to fill those high-density designs while still offering thin dielectric spacing. RO4403, RO4450B, and RO4450B-dx prepregs are based upon the RO4000 series core materials and are compatible in multilayer constructions with either RO4003C or RO4350B laminates. As with RO4000 laminates, RO4400 prepregs are compatible with the majority of standard FR4 processing practices. Visit the new “Green Leader” site at www.rogersgreenworld.com, which contains information on Rogers’ environmentally friendly specialty material products and related compliancy issues. Rogers’ specialty materials are offered worldwide through an extensive network of technical sales offices. Based in Rogers, CT, the corporation manufactures and markets specialty polymer and electronic materials for targeted applications, focusing on communication and computer markets.
http://www.rogerscorporation.com
About: Rogers Corporation
Manufactures and markets specialty polymer and electronic materials for targeted applications, focused on communication and computer markets.Manufacturing locations:
Rogers manufactures its products in fourteen plants, which are located in Arizona, Connecticut, and Illinois in the U.S., and in Gent, Belgium and Asia. Product mix: Specialty materials for communication and computer applications include: High frequency printed circuit board laminates become circuits for cellular telephones and other communication equipment, wireless infrastructure equipment, high speed data transfer, internet servers, and satellite television antennas. Flexible printed circuit board laminates are used in advanced hard disk drives, portable and hand-held computers, cellular telephones, and other electronic equipment. PORON urethanes and BISCO silicones are used to protect and cushion sensitive components in portable and hand-held computers, wireless communication devices, and wireless infrastructure equipment. Rogers Engineered Polyolefin Foams are flexible foam materials for general industrial, automotive, packaging, and sports and leisure applications. From Durel Division electroluminescent lamps and drivers are used for backlighting the displays in wireless communication handsets, pagers, and personal digital assistants. In addition, Rogers elastomer materials are used to cushion and seal a broad variety of industrial and consumer products; cushion insole materials are incorporated into footwear and footcare products; nonwoven and elastomer materials are used for specialized medical applications; elastomer components are used for paper transport in imaging equipment; busbars are used for power distribution in telecom cabinets, train and mass transit systems, and static industrial motor controls; and printing sleeves and R/bak cushion mounting materials are used by the printing industry. Sales information:
Rogers Combined Sales, which include Rogers share of sales by its joint ventures, were $297 million in 2003. Rogers net sales were $243.3 million in 2003. |
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