Golfer247 - The latest news and products from the world of golf
Main Menu | News By Date | News By Supplier | News By Category | About Us
 

INDIUM CORPORATION WILL FEATURE THEIR RELIABILITY PROGRAM AT MEXITRONICA
21 October 2006 - Indium Corporation

A key element of this program is the company's Indium5.1 Series of Pb-Free No-Clean Solder Pastes. According to Ray Altieri, Indium Corporation Market Manager, "this series features unsurpassed print transfer efficiency through small apertures, low BGA/CSP voiding across a wide variety of reflow profiles, industry leading response-to-pause printability, and excellent wetting to all common Pb-Free metallizations.

A key element of this program is the company's Indium5.1 Series of Pb-Free No-Clean Solder Pastes. According to Ray Altieri, Indium Corporation Market Manager, "this series features unsurpassed print transfer efficiency through small apertures, low BGA/CSP voiding across a wide variety of reflow profiles, industry leading response-to-pause printability, and excellent wetting to all common Pb-Free metallizations. These characteristics contribute strongly to our customers' finished goods reliability."

Indium's team of experts will be available at booth # 800 to answer questions and provide information on their RELIABILITY program.

Mexitronica features the full spectrum of products and services fueling Mexico's electronics manufacturing sector. For more information visit www.mexitronica.com.

Indium Corporation is a four-time Frost & Sullivan Award-winning supplier of electronics and semiconductor packaging assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world's premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.

http://www.indium.com

About: Indium Corporation
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world’s premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia.

Founded in 1934, the Indium Corporation attributes its continued success to several intrinsic and distinguishing characteristics:

a genuine desire to excel at solution-based customer service
flexibility that enables on-need delivery of large or small quantities of standard, complex, and custom products
a strong commitment to quality
an ability to attract and retain experienced professionals
an outstanding record of productive investments in technology

Indium is proud of its many award-winning people. We lead the industry with the largest team of SMTA Certified Technical Support personnel. Our staff is frequently tapped to chair technical sessions at regional and international exhibitions.

Our technical contributions often lead to award-winning technical papers and presentations.

Indium Corporation leads the industry on many fronts. We are “The original Pb-Free solder company™” and lead in the effort to eliminate the use of Pb in electronics assembly. Our Pb-Free QuickStart™ program, a partnership with Motorola, has been recognized worldwide.

And our numerous consistent achievements in customer service and product development have resulted in the Indium Corporation being named to the Frost & Sullivan Hall of Fame.

Indium Corporation manufactures over 220 alloys with melting temperatures ranging from 10°C to 450°C, in many forms, including:

Solder Paste
Solder Preforms
Solder Spheres
Solder wire
Solder ribbon
Solder foil
We also manufacture many fabricated products.

And, of course, the Indium Corporation is the world’s leading refiner, producer, and fabricator of indium and indium chemicals.


More News:
  • For October 2006
  • From Indium Corporation
  • For Solders and Electronic Assembly Materials

 

©2008 New Materials International