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News by Category: Solders and Electronic Assembly Materials

Excess chip inventory lingers in Q3, according to iSuppli
01 November 2006 - Indium Corporation
After two quarters of ballooning semiconductor inventories in the electronics supply chain, early results for the third quarter indicate that excess chip stockpiles are not going away.
Cellular phone mania sweeps the Globe, says IC Insights
31 October 2006 - Indium Corporation
A mania continues to sweep around the globe in 2006, a cellular phone mania. Although the computer market is still by far the leading consumer of ICs and is forecast to represent 47% of the 2006 IC market, the electronic system type driving most of the IC market growth this year is cellular phones.
Indium Corporation will feature their RELIABILITY program at Mexitronica
21 October 2006 - Indium Corporation
A key element of this program is the company's Indium5.1 Series of Pb-Free No-Clean Solder Pastes. According to Ray Altieri, Indium Corporation Market Manager, 'this series features unsurpassed print transfer efficiency through small apertures, low BGA/CSP voiding across a wide variety of reflow profiles, industry leading response-to-pause printability, and excellent wetting to all common Pb-Free metallizations.
Business's Most Valuable Marketing Tool?
10 October 2006 - Indium Corporation
'Believe it or not, a blog need not be minute-by-minute updates of mindless self-centered blather. Or pompous political posturing. Or miles and miles of teenage angst. A blog can be a business's most valuable marketing tool.' This is according to an interesting article, written by Leigh Allen, appearing in the Dayton Daily News.
Indium Corporation assists special Olympians
19 September 2006 - Indium Corporation
Indium Corporation participated in the Special Olympics Airlift, which provides transportation to over 1,500 athletes from all over the country to the 2006 US National Games in Ames, Iowa, USA. In a well-coordinated effort synchronized by the Cessna Corporation, 235 volunteer Cessna Citations transported the athletes to Iowa for the start of the games, then back home again after the closing ceremonies.
First Industry Blog Launched
01 March 2005 - Indium Corporation
Indium Corporation has launched a web log (blog) focusing on the electronics assembly industry. Announced at APEX, The blog, authored by noted technologist, industry author, editorialist, lecturer, and scientist, Dr. Ronald C. Lasky, presents comments, insights, and observations on activities and events related to the electronics assembly industry.
Dr. Ning-Cheng Lee to speak at SMTA Shanghai Technology Summit
28 February 2005 - Indium Corporation
Dr. Ning-Cheng Lee, Indium Corporation's VP of Technology, will present 'The Transition to Lead-free Production: From iNEMI Roadmap to Production' at the SMTA Technology Summit held concurrently with NEPCON Shanghai. His presentation, made on behalf of iNEMI, will be held on 10-11 April.
Indium Corporation Completes ISO Audit Successfully
24 February 2005 - Indium Corporation
Indium Corporation has completed their third surveillance audit since transitioning to ISO9001:2000. The process involved over 20 individuals at both the Utica and Clinton, NY manufacturing facilities and resulted in no 'minor' or 'major' findings.
Indium Corporation to Exhibit at IMAPS ­ Cambridge
23 February 2005 - Indium Corporation
Indium Corporation will exhibit at IMAPS MicroTech 2005 on March 1 & 2. The show, is taking place at the Moller Conference Center in Cambridge, England, features Photonics, Power Packaging, Flip-Chip Technology, and Packaging Reliability.
Indium Corporation Announces New Distributor in Denmark
17 February 2005 - Indium Corporation
Indium Corporation of America has announced that PC Trading has become its newest distributor in Europe, covering Denmark. PC Trading was founded in 1986 and will be responsible for selling Indium Corporation's extensive line of Solder Pastes, Wave Solder Fluxes, Solder Wire and Solder Preforms.
Indium Corporation Announces New Distributor in Denmark
16 February 2005 - Indium Corporation
Indium Corporation of America has announced that PC Trading has become its newest distributor in Europe, covering Denmark.
Stencils smooth transition to lead-free processing
22 December 2004 - Tecan
A combination of proven design features present the most efficient way of ensuring solder paste printing stencils offer the best possible performance when faced with present-day and future challenges facing PCB manufacturers, says Dorset based market leader, Tecan.
Indium Corporation Introduces Water-Soluble Pb-Free Solder Paste
17 February 2004 - Indium Corporation
To meet the high demands of water-soluble solder paste users who need to comply with the Pb-Free requirements, Indium Corporation of Europe has developed the next generation of Pb-Free Solder Paste, Indium3.1. Indium3.1 is a water-soluble Pb-free solder paste with advanced printing capability, ideal for fine-pitch applications. The exceptional stencil life virtually eliminates solder paste waste.


 

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