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| New low viscosity, flexible UV curable composition formulated for fast, high performance laminating |
17 February 2007 - Master Bond
Master Bond Inc. of Hackensack, New Jersey has developed UV19, a new low viscosity, flexible UV curable composition formulated for fast, high performance laminating, sealing, bonding and casting. It is an optically clear, mobile liquid which cures readily upon exposure to UV light at ambient temperatures to a flexible strong solid with superior mechanical strength properties and excellent adhesion to many different substrates including most plastics and glasses as well as metals. The UV19 system is 100% reactive and does not contain any volatiles. Unlike many other commercially offered UV curing compounds, its cure is not inhibited by air and it exhibits minimal shrinkage when cured. UV19 has excellent resistance to water and many other aggressive chemicals. |
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| 10HTFL new one component flexible high performance epoxy resin based adhesive/sealant |
16 February 2007 - Master Bond
Master Bond Polymer System Supreme 10HTFL is a new one component flexible high performance epoxy resin based adhesive/sealant with an exceptionally wide service temperature range of -300°F to +300°F. It cures readily to a tough, strong flexible thermoset polymer at temperatures of 250-300°F and above. Unlike other commercially available flexible one part epoxy adhesive sealants, it features extended ambient temperature storage capability and does not require refrigeration for extended storage before use. Master Bond Polymer System Supreme 10HTFL features high physical strength properties and excellent adhesion to a wide range of both metallic and nonmetallic substrates even upon prolonged exposure to hostile environmental conditions. Adhesive and sealing properties to aluminum, steel and other metals, as well as fiber reinforced composites, most plastics, ceramics, glass, wood, etc. are remarkably high. Tensile lap shear strengths of more than 2000 psi and T-peels in excess of 60 pli are obtained for aluminum bonding. |
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| New USP class VI approved Epoxy adhesive resists sterilants |
15 February 2007 - Master Bond
Master Bond Inc, Hackensack, N.J. has developed EP62-1MED, a new, two component epoxy adhesive system which features outstanding chemical and temperature resistance. This compound is specifically designed to withstand repeated cycles of steam, ethylene oxide, radiation and chemical sterilization. EP62-1MED cures at moderately elevated temperatures (150°F-200°F) and offers an exceptional long working life at room temperatures. It contains no solvents or volatiles and has a 100 to 10 mix ratio by weight. |
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| New one part UV and heat curable Epoxy System |
13 February 2007 - Master Bond
Master Bond Inc., Hackensack, N.J. is pleased to announce the development of a special dual cure (UV/heat curable) epoxy system called UV15DC80. It is designed for bonding, sealing, coating and potting applications. This compound has a low viscosity, is easy to apply and requires no mixing. Environmentally friendly, it is 100% solid and contains no solvents or volatiles. UV15DC80 is not inhibited by oxygen and has low shrinkage upon cure. |
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| New one part silicone elastomer has high transparency to visible light |
12 February 2007 - Master Bond
A new one component high performance silicone elastomer compound for bonding, sealing and coating has been developed by Master Bond Inc., Hackensack, N.J. called MasterSil 415. This formulation has high transparency and is particularly well suited for optical and display applications. It cures at ambient temperatures to a flexible, rubbery solid when exposed to atmospheric moisture. It is easy to apply and has a paste consistency. It can be applied on vertical surfaces without sagging or running. |
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| New one component adhesive/sealant resists up to 600°F |
03 September 2006 - Master Bond
Master Bond Inc., Hackensack, N.J. has developed a new toughened one component heat curing epoxy adhesive/sealant, called EP17. This compound has a service operating range of from -300°F to as high as 600°F. It is formulated to cure at temperatures from 300°F to 350°F for 60-90 minutes. EP17 bonds well to a variety of substrates including metals, glass, ceramics, vulcanized rubbers and many plastics. It has excellent resistance to a wide range of chemicals including fuels, acids, bases, oils and many solvents. |
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| New one component flexible high performance epoxy resin based adhesive with an exceptionally wide service temperature range |
26 August 2006 - Master Bond
Master Bond Polymer System Supreme 10HTFL is a new one component flexible high performance epoxy resin based adhesive/sealant with an exceptionally wide service temperature range of -300°F to +300°F. It cures readily to a tough, strong flexible thermoset polymer at temperatures of 250-300°F and above. Unlike other commercially available flexible one part epoxy adhesive sealants, it features extended ambient temperature storage capability and does not require refrigeration for extended storage before use. Master Bond Polymer System Supreme 10HTFL features high physical strength properties and excellent adhesion to a wide range of both metallic and nonmetallic substrates even upon prolonged exposure to hostile environmental conditions. Adhesive and sealing properties to aluminum, steel and other metals, as well as fiber reinforced composites, most plastics, ceramics, glass, wood, etc. are remarkably high. Tensile lap shear strengths of more than 2000 psi and T-peels in excess of 60 pli are obtained for aluminum bonding. |
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| New one component flexible high performance epoxy based adhesive/sealant has long term ambient temperature storage capability |
26 August 2006 - Master Bond
Master Bond Polymer System Supreme 10HTFL is a new one component flexible high performance epoxy resin based adhesive/sealant with an exceptionally wide service temperature range of -300°F to +300°F. It cures readily to a tough, strong flexible thermoset polymer at temperatures of 250-300°F and above. Unlike other commercially available flexible one part epoxy adhesive sealants, it features extended ambient temperature storage capability and does not require refrigeration for extended storage before use. Master Bond Polymer System Supreme 10HTFL features high physical strength properties and excellent adhesion to a wide range of both metallic and nonmetallic substrates even upon prolonged exposure to hostile environmental conditions. |
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| High strength one part epoxy adhesive cures at 80°C |
20 August 2006 - Master Bond
Master Bond Supreme 3HT-80 is a new one component heat curing epoxy adhesive developed by Master Bond Inc. Supreme 3HT-80 exhibits both high shear and high peel strength. It offers superior resistance to impact, thermal shock, vibration and stress fatigue cracking. This no mix compound has an unlimited working life and cures within 30 minutes at 175°F (80°C). |
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| Master Bond Inc., has developed a new toughened one component heat curing epoxy adhesive/sealant |
31 July 2006 - Master Bond
Master Bond Inc., Hackensack, N.J. has developed a new toughened one component heat curing epoxy adhesive/sealant, called EP17. This compound has a service operating range of from -300°F to as high as 600°F. It is formulated to cure at temperatures from 300°F to 350°F for 60-90 minutes. EP17 bonds well to a variety of substrates including metals, glass, ceramics, vulcanized rubbers and many plastics. It has excellent resistance to a wide range of chemicals including fuels, acids, bases, oils and many solvents. |
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| New high strength one part epoxy adhesive cures at 80°C |
20 March 2006 - Master Bond
Master Bond Supreme 3HT-80 is a new one component heat curing epoxy adhesive developed by Master Bond Inc. Supreme 3HT-80 exhibits both high shear and high peel strength. It offers superior resistance to impact, thermal shock, vibration and stress fatigue cracking. This no mix compound has an unlimited working life and cures within 30 minutes at 175°F (80°C). |
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| New two component nickel conductive epoxy adhesive |
08 February 2006 - Master Bond
Master Bond Inc. of Hackensack, New Jersey has developed a new two component, room temperature curing, nickel filled, electrically conductive epoxy adhesive called EP76M. EP76M has a convenient one to one mix ratio by weight or volume. It has a volume resistivity of 5-10 ohm-cm and excellent low outgassing properties. It has a thermal conductivity of 8-9 BTU/in/ft²/hr/°F. EP76M readily develops a tensile shear strength of 2,000 psi when measured and cured at room temperature. |
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| USP class VI approved adhesive resists exposure to repeated sterilization |
01 August 2005 - Master Bond
Master Bond Inc. of Hackensack, New Jersey has developed a new two component heat cured epoxy adhesive called EP45HT MED. This compound is durable, tough and resistant to exposure to thermal shock and many chemicals. It can withstand long term exposure form -80°F to 500°F and has a glass transition temperature of >185°C. Adhesion to metals, glass, ceramics, wood, vulcanized rubber and many plastics is excellent. The cured system is a superb electrical insulator. |
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| USP class VI approved adhesive resists exposure to repeated sterilization |
01 August 2005 - Master Bond
Master Bond Inc. of Hackensack, New Jersey has developed a new two component heat cured epoxy adhesive called EP45HT MED. This compound is durable, tough and resistant to exposure to thermal shock and many chemicals. It can withstand long term exposure form -80°F to 500°F and has a glass transition temperature of >185°C. Adhesion to metals, glass, ceramics, wood, vulcanized rubber and many plastics is excellent. The cured system is a superb electrical insulator. |
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| A new flexible, low viscosity UV curable compound specially designed for high performance |
18 April 2005 - Master Bond
Master Bond Inc. of Hackensack, New Jersey has developed UV19, a new low viscosity, flexible UV curable composition formulated for fast, high performance laminating, sealing, bonding and casting. It is an optically clear, mobile liquid which cures readily upon exposure to UV light at ambient temperatures to a flexible strong solid with superior mechanical strength properties and excellent adhesion to many different substrates including most plastics and glasses as well as metals. The UV19 system is 100% reactive and does not contain any volatiles. Unlike many other commercially offered UV curing compounds, its cure is not inhibited by air and it exhibits minimal shrinkage when cured. UV19 has excellent resistance to water and many other aggressive chemicals. |
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| Low viscosity UV curable compound designed for high performance laminating, sealing, bonding & coating |
18 April 2005 - Master Bond
Master Bond Inc. of Hackensack, New Jersey has developed UV19, a new low viscosity, flexible UV curable composition formulated for fast, high performance laminating, sealing, bonding and casting. It is an optically clear, mobile liquid which cures readily upon exposure to UV light at ambient temperatures to a flexible strong solid with superior mechanical strength properties and excellent adhesion to many different substrates including most plastics and glasses as well as metals. The UV19 system is 100% reactive and does not contain any volatiles. Unlike many other commercially offered UV curing compounds, its cure is not inhibited by air and it exhibits minimal shrinkage when cured. UV19 has excellent resistance to water and many other aggressive chemicals. |
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| Silver conductive epoxy adhesive has rapid set up time |
04 February 2005 - Master Bond
Master Bond Inc. of Hackensack, New Jersey has developed EP77M-F, a new, two component, silver filled, electrically conductive epoxy adhesive for high performance bonding. This compound has a low volume resistivity of 10-3 ohm-cm. It will set up in 5-10 minutes at room temperature, even when applied in very small amounts. Full cure usually takes 8-12 hours at room temperatures. Electrical conductivity develops rapidly and is first detectable within 30-60 minutes. |
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| Silver conductive epoxy adhesive has rapid set up time |
04 February 2005 - Master Bond
Master Bond Inc. of Hackensack, New Jersey has developed EP77M-F, a new, two component, silver filled, electrically conductive epoxy adhesive for high performance bonding. This compound has a low volume resistivity of 10^-3 ohm-cm. It will set up in 5-10 minutes at room temperature, even when applied in very small amounts. Full cure usually takes 8-12 hours at room temperatures. Electrical conductivity develops rapidly and is first detectable within 30-60 minutes. |
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| Non-halogenated epoxy resin system features outstanding flame resistance and minimal smoke generation |
20 December 2004 - Master Bond
Master Bond has developed a new non-halogenated epoxy resin system called EP21HTFR-1 which offers outstanding flame resistance and minimal smoke generation even upon prolonged exposure to open flames. |
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| Practical solution for dispensing and applying ultra-fast cure two component epoxy resin |
01 December 2004 - Master Bond
Master Bond Polymer System EP65HT-1 provides the first practical solution for dispensing and applying ultra-fast cure 10:1 mix ratio two component epoxy resin compositions. |
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| One part epoxy adhesive meets USP Class VI |
01 December 2004 - Master Bond
Master Bond announces the first one part epoxy adhesive system that fully meets USP Class VI requirements and withstands repeated sterilisations. |
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| Commercial epoxy adhesive with peel and impact strength |
01 December 2004 - Master Bond
Many commercial epoxy adhesives have high shear strength but lack sufficient peel and impact strength properties. Master Bond one component epoxy adhesive Supreme 10HT overcomes this long recognized deficiency. |
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| High temperature resistant epoxy has exceptional thermal conductivity |
15 September 2004 - Master Bond
Master Bond Inc. of Hackensack, New Jersey has introduced a new high performance, room temperature curing, two component epoxy adhesive/sealant called EP34AN. This compound features a thermal conductivity of 22-24 BTU/in/ft²/hr/°F. Physical properties are maintained even after long exposure to temperatures in the 400-450°F range. EP34AN has superb dimensional stability and a low coefficient of expansion. It also exhibits superior electrical insulation properties. |
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| New room temperature curing epoxy resists sterilization |
04 August 2004 - Master Bond
Master Bond Inc. of Hackensack, New Jersey has introduced a new room temperature curing, two component epoxy adhesive, sealant, coating and casting material called EP42HT-2. This compound features high temperature resistance along with outstanding chemical resistance. It is widely used in medical devices because of its ability to withstand repeated sterilizations, including radiation, ethylene oxide, chemical sterilants and steam. In addition it fully complies with the testing requirements of USP Class VI plastics. |
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| New fast curing epoxy adhesive |
01 June 2004 - Master Bond
Master Bond Inc. of Hackensack, New Jersey has developed EP24, new fast curing, two component epoxy adhesive. This high performance system cures at room temperature or more rapidly at elevated temperatures. Additionally, it will cure at colder temperatures, down to 20°F. It is easy to use and has a convenient non critical mix ratio of 1 to 1 by weight or volume. The adhesive spreads evenly and smoothly. It is 100% reactive and contains no volatiles or solvents. |
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| New epoxy adhesive resists high temperatures |
15 March 2004 - Master Bond
A unique two component, room temperature curing, high temperature resistant epoxy adhesive called EP35 has been introduced by Master Bond Inc., Hackensack, N.J. This system produces high strength bonds whose strength is maintained even after long exposures to temperatures in the 450°F-500°F range. It has a 100 to 70 mix ratio by weight and can be applied without sagging or dripping even on vertical surfaces. |
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| Thermal conductive adhesive has convenient one to one mix ratio |
02 February 2004 - Master Bond
Master Bond EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive with a forgiving 1 to 1 mix ratio by weight or volume. Developed by Master Bond Inc., Hackensack, N.J. this compound is extremely versatile and will adhere well to variety of similar and dissimilar substrates. It has a low coefficient of expansion, low shrinkage and superb dimensional stability. It also exhibits superior durability and chemical resistance. |
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| High temperature resistant epoxy offers outstanding chemical resistance |
28 June 2003 - Master Bond
Master Bond Inc. of Hackensack, New Jersey has developed a new two component epoxy system for service above 500°F. Called EP125, this compound is designed to withstand exposure to boiling acids, alkalis, salts, fuels and most organic solvents. It offers high bond strength to metallic and nonmetallic surfaces. Typical lap shear strengths are in the order of 2,400-2,500 psi at ambient temperatures. After heat aging for 1,000 hours at 500°F, slightly less than 50% of the original bond strength is retained. Castings exhibit flexural strength as high as 15,000 psi and flexural moduli of more than 500,000 psi. |
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| Rapid curing epoxy adhesive has high flexibility |
12 June 2003 - Master Bond
Master Bond EP51FL is a new two component, highly flexible epoxy resin system developed by Master Bond Inc., Hackensack, N.J. for high performance bonding. EP51FL has a 1 to 1 mix ratio, weight or volume. It cures rapidly at room temperature and has a setup time of 30-40 minutes. Cure speeds can be accelerated by the use of heat. It is a 100% reactive system and no solvents or volatiles are emitted during cure. |
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| Aluminum filled epoxy available for enhanced machinability |
08 May 2003 - Master Bond
A new room temperature curing, aluminum filled two component epoxy adhesive called EP22 has been introduced by Master Bond Inc. Hackensack N.J. This system has an easy to use one to one mix ratio by weight or volume. It produces durable high strength and tough bonds with outstanding adhesion to metals, particularly steel and aluminum. Bonds are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents. |
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| One component silver conductive adhesive system meets NASA outgassingtTest requirements |
30 January 2003 - Master Bond
Master Bond Polymer System Supreme10HT/S is a uniquely formulated silver filled one component epoxy compound with an unsurpassed wide service temperature range from cryogenic service temperatures up to as high as 400°F. This remarkably versatile electrically conductive epoxy composition features high physical strength properties, superior chemical resistance and excellent durability even when exposed to various severe environmental conditions. Additionally it fully meets NASA low outgassing requirements. |
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| New tough, resilient adhesive resists high impact |
31 October 2002 - Master Bond
It is formulated to cure at room temperature or more rapidly at elevated temperatures with a convenient one to one mix ratio, weight or volume. Bonds are resistant to thermal cycling and chemicals including water, gasoline, oils, greases and other petroleum products. |
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