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Electronic Materials
Layered semiconducting black arsenic phosphorus alternative to silicon
Electronic Materials (General) : 24 July, 2015
Graphene, the only one atom thick carbon network, achieved overnight fame with the 2010 Nobel Prize. But now comes competition: Such layers can also be formed by black phosphorous. Chemists at the Technical University of Munich (TUM) have now developed a semiconducting material in which individual phosphorus atoms are replaced by arsenic. In a collaborative international effort, American colleagues have built the first field-effect transistors from the new material.
Proprietary lead-free alloy for EON-compliant pin technology delivers PCB assembly savings
Solders and Electronic Assembly Materials : 20 April, 2015
Molex is using a proprietary grade alloy material for consistent production of high performance and economical EON compliant products using lead-free processes.
Transparency in mould handling
RFID Tagging : 17 April, 2015
Mold ID from Balluff supports condition-based maintenance and provides more transparency in mould handling.
Automotive EMI shielding: silicone gels enable lighter structures
EMI Shielding : 11 March, 2015
Although EMI and thermal issues have been prevalent in the military and aerospace sectors for many years, the rapid development and evolution of both automotive electronics and vehicle electric drive systems means that Chomerics is witnessing increasing numbers of automotive industry customers seeking innovative solutions to these problems.
Temperature-stable solder paste cuts logistics costs
Solders and Electronic Assembly Materials : 11 March, 2015
The Electronics Group of Henkel announces the launch of a temperature stable solder paste material, which it claims to be the first-ever. Loctite GC10, is temperature stable at 26.5C for one year and stable at temperatures of up to 40C for one month, which affords exceptional performance throughout the logistics and operations chain – from shipping/receiving to printing and reflow.
Ultrafast Laser Plasma Implantation (ULPI) to take IT beyond the electronic age
Functional Materials : 28 December, 2014
A £5.2 million project led by the University of Leeds is aiming to transform data communications with a new generation of photonic microchips. The Engineering and Physical Sciences Research Council (EPSRC) has announced funding for a multi-university research programme and a pilot manufacturing facility, to be based at Leeds, that will develop the materials needed for the new class of "photonic integrated circuits’.
Metal-oxide clusters for molecular storage devices could bridge memory gap
Molecular Electronics : 28 November, 2014
New molecules could be the key to solving a looming problem with flash memory storage, researchers from the University of Glasgow are saying.
Research on amorphous chalcogenides lights the way to super-fast computers
Glass Semi-Conductors : 08 November, 2014
New research demonstrates how glass can be manipulated to create a material that will allow computers to transfer information using light. This development could significantly increase computer processing speeds and power in the future.
Non-magnetic, high temperature resistant packaging for microelectronic components
Electronic Materials (General) : 07 October, 2014
Kyocera’s development of this innovative ceramic packaging is based on established HTCC technology (High Temperature Co-Fired Ceramics), which is currently used with specific non-magnetic piece parts and plating options. Kyocera is now presenting a new type of HTCC with platinum metallization on the top surface and in ceramic multilayering.
European partners collaborate in ′development of replacement of ITO for OLEDs
Polymer OLED Devices : 20 September, 2014
Currently the commercialisation of Organic Light Emitting Diode (OLED) and Organic Photovoltaic (OPV) based applications such as flexible displays, lighting and energy harvesting devices is heavily dependent on the use of indium tin oxide (ITO) for transparent conducting films, and encapsulation films with high performance barrier properties. There is an industry need for the creation of alternative technologies and materials that have equal performance but deliver low cost, sustainable, transparent and flexible products for these applications. Throughout Europe, it is proving extremely difficult to develop the manufacture of these alternative materials beyond laboratory scale to the position where they are available in large area quantities at a price compatible with supporting market growth.
For electronics beyond silicon, correlated oxides emerge
Semiconductor Materials, including Silicon and Transistor Materials : 20 September, 2014
Using a quantum material called a correlated oxide, Harvard researchers have achieved a reversible change in electrical resistance of eight orders of magnitude, a result the researchers are calling "colossal.’ In short, they have engineered this material to perform comparably with the best silicon switches.
Neutron scattering experiment resolves a contentious superconducting issue
Superconductors : 10 August, 2014
Scientists around the globe are trying to understand the phenomenon of loss-free electric power transmission by high-temperature superconductors. Materials that exhibit this effect at room temperature would bear huge technical potential. Recently symmetry changes in the electronic phases of high-temperature superconductors near their transition temperature had been attributed to doping effects. But an international team of scientists has now discovered that solely spin dynamics of the electrons are responsible for these spontaneous changes.
Density functional theory shows Ti-V alloys’ superconductivity is inherent, not accidental
Superconductors : 03 July, 2014
Research shows that all of the Ti-V alloys could display a relatively high superconducting transition temperature. It is deduced that spin fluctuations are reflected in the properties of the normal state of electrons. They therefore influence the superconductivity of the alloys in a similar way to that observed in high-temperature oxide and iron-based superconductors; as such, the influence of spin fluctuations on superconductivity is not necessarily confined to certain classes of exotic compounds, as previously thought.
Conductive Inks: booming to $2.8 billion by 2024
Lithography : 22 April, 2014
The conductive ink and paste business is segmented, consisting of many emerging and mature markets. In the new report Conductive Ink Markets 2014-2024: Forecasts, Technologies, Players IDTechEx sees the market experiencing 4.5% CAGR over the coming decade, although growth will be unevenly spread with several target markets experiencing rapid growth while others decline. Dr Khasha Ghaffarzadeh, Head of Consulting, IDTechEx, expands.
Can germanium replace silicon in mid-infrared group IV photonics?
Semiconductor Materials, including Silicon and Transistor Materials : 27 March, 2014
A new research project led by the University of Southampton is aiming to establish whether germanium, a group IV semiconductor, can be used as the material of choice in mid-infrared (mid-IR) photonics circuits and sensors.
Strontium nitrate potential alternative to silicon for microelectronic devices?
Metal Oxide Films : 10 March, 2014
Usually, microelectronic devices are made of silicon or similar semiconductors. Recently, the electronic properties of metal oxides have become quite interesting. These materials are more complex, yet offer a broader range of possibilities to tune their properties. An important breakthrough has now been achieved at the Vienna University of Technology: a two dimensional electron gas was created in strontium titanate. In a thin layer just below the surface electrons can move freely and occupy different quantum states.
Tipping Point reached in printed and flexible electronics?
Lithography : 14 February, 2014
Dr Harry Zervos, Senior Technology Analyst, IDTechEx, reflects that 2014 has only just began and already discussions abound on how a "tipping point" has been reached in the field of printed and flexible electronics, a statement mostly backed by the significant interest and accompanying investment by LG and Samsung into the commercialisation of flexible displays.
Nanoparticles could turn windows into computer screens
Electronic Materials (General) : 31 January, 2014
US researchers at the Massachusetts Institute of Technology (MIT) are developing a way to turn ordinary pieces of glass into transparent computer displays using attachable plastic sheets full of nanoparticles.
Ultra-flexible OTFT device array suitable for the foldable AMOLED displays of the future
Polymer OLED Devices : 27 January, 2014
The Centre for Process Innovation (CPI), the UK’s National Centre for Printable Electronics. has developed novel backplane fabrication processes to allow the bending of Organic Thin Film Transistors (OTFT) arrays to small radii (c.1mm) without a significant reduction in device performance. The work undertaken demonstrates progress towards optimum Organic Semiconductor (OSC)/OTFT processing and performance to enable their integration into ultra-flexible active matrix organic light emitting diode AMOLED backplanes.
Research team opens graphene band-gap for electronics applications
Molecular Electronics : 19 December, 2013
Ulsan National Institute of Science and Technology (UNIST) has announced a method for the mass production of boron/nitrogen co-doped graphene nanoplatelets, which led to the fabrication of a graphene-based field-effect transistor (FET) with semiconducting nature. This opens up opportunities for practical use in electronic devices.
Multiferroics - magnetic properties influenced by electric voltage - open up new sensor prospects
Functional Materials : 02 December, 2013
In the extraordinary materials called "multiferroics’, electric and magnetic excitations are closely linked. Scientists at the Vienna University of Technology (TU Wien) have now shown in an experiment that magnetic properties and excitations can be influenced by an electric voltage. This opens up completely new possibilities for electronics at high frequencies. There are many ideas for future applications - wherever it is desirable to combine the respective advantages of magnetic and electric effects, the new magneto-electric materials could be used. This could lead to new kinds of amplifiers, transistors or data storage devices. Also, highly sensitive sensors could be built with electromagnon technology.
Platinum-doped polymer emits brighter, whiter, light
Polymer OLED Devices : 14 October, 2013
By inserting platinum (Pt) atoms into an organic semiconductor, a group at the University of Utah has tuned the polymer to emit light of different colours - a step towards truly white organic LEDs (OLEDs) for lighting. Existing white-emitting OLEDs use other techniques for white output, such as combining a blue OLED with a yellow phosphor.
Tenth anniversary of low silver, lead-free (SACX) alloy
Solders and Electronic Assembly Materials : 26 September, 2013
It is 10 years ago that Alpha launched its innovative new lead-free, low-silver solder alloy Alpha SACX. This new alloy enabled the conversion from tin-lead (Sn-Pb) alloys to lead-free alloys in response to the RoHS regulations introduced in the European market.
Advanced applications of high temperature magnetics
Electronic Materials (General) : 24 June, 2013
By combining high temperature, grain oriented magnetic materials along with high temperature packaging processes, Arkansas Power Electronics International (APEI) has created advanced high temperature magnetic systems that are viable for applications across a wide range of high temperature electronics systems.
EPSMA releases its lead-free soldering guidelines
Solders and Electronic Assembly Materials : 03 March, 2013
To raise awareness of not so commonly understood areas in lead-free soldering, the European Power Supply Manufacturers Association (EPSMA) has published a paper which examines reliability characteristics in detail and provides recommendations to minimise, and where possible, avoid any degradation of reliability.
Microsemi to lead ELCOSINT team to develop material for high-temperature electronics
Solders and Electronic Assembly Materials : 03 March, 2013
Microsemi Corporation has been elected to lead the Electronic Component Sintered Interconnections (ELCOSINT) industry team in developing novel polymeric, sintered interconnection materials to replace high lead (Pb) content materials and further increase the operating temperature of electronic assemblies.
Ink evaluation kit for flexible thin film transistors (TFTs)
Printed Electronics : 24 February, 2013
SmartKern's Technology Transfer Kit combines education and technical support to further advances in next generation flexible displays for use in smartphones and tablets.
Layered oxide heterostructures promise improved solar cells
Electronic Materials (General) : 20 February, 2013
Researchers at the Vienna University of Technology show that a recently discovered class of materials - Layered oxide heterostructures - can be used to create a new kind of solar cell.
The effect of lead-free soldering on tantalum capacitors
Solders and Electronic Assembly Materials : 11 January, 2013
Legislation is being developed worldwide to reduce the lead content in many consumer electronic products. An historical paper from AVX has been identified which focuses on one component technology in particular - surface-mount tantalum capacitors with manganese dioxide and conductive polymer electrodes - and outlines a programme that will verify whether these devices are ready to meet the new legislation.
Liquid-free preparation of high purity Metal Organic Frameworks (MOFs) could progress sensors and magnetic materials
Metal Oxide Films : 03 January, 2013
Researchers at Aldrich Materials Science have discovered an innovative way to design an important class of three-dimensional (3D) hybrid structures, Metal Organic Frameworks (MOFs), under completely liquid-free conditions. High purity MOF products prepared by the liquid-free process may be ideally suited as rare earth containing materials for sensors and detectors, electronic or magnetic materials. The discovery also extends liquid-free preparation techniques to a large new class of 3D-structured materials and is expected to lead to new products with unique properties and suitability for applications heretofore unknown.
Titanium compounds predicted for big future in new electronics era
Electronic Materials (General) : 22 September, 2012
This article by Dr Peter Harrop, Chairman, IDTechEx, shares some of the research carried out for a new IDTechEx report requested by several of the world’s largest chemical companies. They wish to de-risk their materials development programs concerned with electrically functional elements and compounds.
SmartKem receives investment funding to continue development of flexible printed alternative to silicon semiconductors
Printed Electronics : 25 April, 2011
SmartKem is a developer of novel, printable organic semiconductor materials and ink formulations for flexible electronics. The company has received investment funding from the Porton Capital Group and Finance Wales Investmentsto further develop its flexible printed electronics solutions.
Aldrich Materials Science collaborates with Agfa to expand organic and printed electronics portfolio
Printed Electronics : 06 April, 2011
Aldrich Materials Science has entered into collaboration with Agfa Materials to produce and distribute Orgacon conductive polymers for use in high technology applications including, organic photovoltaics, touch screens and printed sensors.
Indium Corporation blogs now available in seven languages
Solders and Electronic Assembly Materials : 25 March, 2011
In a sign of the times, Indium Corporation has expanded their blogging program to provide posts in seven languages. This provides more customers the opportunity to read Indium Corporation
Terra-Barriers - Moisture barriers for Flexible Electronics
Electronic Materials (General) : 23 March, 2011
Defects on plastic substrates such as pinholes, cracks and grain boundaries cause a 'pore effect', where oxygen and water molecules are able to seep through and penetrate through the plastic barrier and into the active material. For applications such as flexible OLED displays, organic solar cells, or even electrophoretic displays, sensitivity to oxygen and moisture compromises device lifetime significantly. This means that in order to achieve adequate lifetime for flexible devices that would make viable commercial products, the pathway for oxygen and moisture down into the active layers must be blocked.
New developments in high performance solder products for power die assemblies
Solders and Electronic Assembly Materials : 18 March, 2011
The use of special purpose solder pastes in power die attach is well-established offering low voiding and reliable bonding in volume manufacturing. However these materials are designed around high lead alloys and applied by dispensing. IGBT circuits are made by printing high tin alloys to multiple die sites, placing die and reflowing in a process more similar to conventional PCB or hybrid thick film assembly.
The regions of the world see printed electronics differently
Printed Electronics : 11 March, 2011
Printed electronics is one of the most important new enabling technologies. It will have a major impact on most business activities from publishing and security printing to healthcare, automotive, military and consumer packaged goods sectors. It is now recognised that commercialisation can and should take place in very disparate applications, contrasting with the rather narrow view of possibilities in the past.
Printed Electronics in Asia - the hot sectors
Printed Electronics : 25 October, 2010
The display business is huge and there is significant progress and development by East Asian companies in a number of different printed display technologies.
Printed electronics without borders
Printed Electronics : 05 September, 2010
Printed Electronics are being developed by over 3,000 companies, universities and research institutes worldwide. Although a significant percentage of these developers are located in countries such as the USA, Germany, Japan and South Korea, there's a lot of research effort in other countries also, even if the concentration of active companies active is lower. The two examples described below are the CSIRO in Australia and the A*Star-IMRE in Singapore.
Global RFID market continues to grow
RFID Tagging : 05 September, 2010
The global RFID business has grown about five fold in the last ten years and analyst IDTechEx has detailed reasons for seeing the market grow 4.2 times in value over the next ten years. However, many of the government initiatives that powered past growth are largely completed, such as e-passports and the Chinese National ID card, so where does that future growth come from? by Dr. Peter Harrop, Chairman, IDTechEx
Transient liquid-phase sintering (TLPS) materials offer alternative to lead-free solder for power semiconductors
Solders and Electronic Assembly Materials : 23 April, 2010
Indium Corporation announces a joint marketing and technical support agreement for high-temperature Pb-free electronics assembly materials patented and manufactured by Ormet Circuits.
Metallisation of 3D Moulded Interconnect Devices (MIDs) creates three-dimensional connections with multiple contacts
3D Moulded Interconnect Devices (MIDs) : 09 February, 2010
The two-shot moulding process produces MIDs from a combination of plateable and non-plateable injection moulded resins. A non-plateable polymer is moulded in the first shot and is then selectively moulded with a second plateable material, leaving specified areas exposed. An etching step then activates the exposed areas of plateable polymer so that those areas can be plated with metal.
Magnetism a key driver of high temperature superconductivity
Superconductors : 21 January, 2009
Strong evidence that magnetic fluctuations are key to a universal mechanism for pairing electrons and enabling resistance-free passage of electric current in high-temperature superconductors.
Functional Materials : 06 January, 2009
A new material created by research scientists can rapidly shrink or swell to change the colour of light that it scatters.
Blending polymer and organic semiconductors
Electronic Materials (General) : 29 October, 2008
The optimised blend of polymer and organic semiconductors has better performance characteristics than the organic semiconductor alone.
IMEC paves the way towards optical sensing foils
Optical Waveguides : 07 October, 2008
New PAS 5500/1100TM system combines 90 WPH productivity with imaging performance
Lithography : 13 August, 2007
ASML introduced its newest 193nm Step & Scan lithography tool for high-volume production of semiconductor devices at the 100nm technology node. The PAS 5500/1100TM system provides the highest value of ownership for leading-edge IC makers by combining a 0.75 numerical aperture lens, improved leveling performance and industry-leading overlay with an exposure capacity exceeding 90 200mm wafers per hour at a dose of 20 mJ/cm2.
New lithography system with the highest numerical aperture
Lithography : 12 August, 2007
ASML Holding NV announced a new lithography system with the highest numerical aperture, 1.2, in the semiconductor industry. The ASML TWINSCAN XT:1700i system is a 193 nm immersion scanner capable of volume chip production at the 45 nm node.
New immersion lithography system a 0.85 NA, 193 nm pre-production lithography scanner
Lithography : 11 August, 2007
ASML Holding NV announced the industry
ASML now offers the highest numerical aperture at every major production wavelength
Lithography : 10 August, 2007
ASML introduced the industry's first KrF (248nm) Step & Scan 300mm dual stage lithography system capable of 110nm resolution. The TWINSCAN AT:850B(tm) features Carl Zeiss Starlith(tm)850 advanced projection optics with a numerical aperture of 0.80, which is the highest NA available in a KrF system.
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