Free Newsletter
Register for our Free Newsletters
Newsletter
Zones
Advanced Composites
LeftNav
Aerospace
LeftNav
Amorphous Metal Structures
LeftNav
Analysis and Simulation
LeftNav
Asbestos and Substitutes
LeftNav
Associations, Research Organisations and Universities
LeftNav
Automation Equipment
LeftNav
Automotive
LeftNav
Biomaterials
LeftNav
Building Materials
LeftNav
Bulk Handling and Storage
LeftNav
CFCs and Substitutes
LeftNav
Company
LeftNav
Components
LeftNav
Consultancy
LeftNav
View All
Other Carouselweb publications
Carousel Web
Defense File
New Materials
Pro Health Zone
Pro Manufacturing Zone
Pro Security Zone
Web Lec
Pro Engineering Zone
 
 
 
News

A new ultra-compact, leadless package that provides space savings of 25%

Vishay Electronic : 31 March, 2003  (New Product)
A new ultra-compact, leadless package that provides space savings of 25% compared to the SOT363 package and as much as 60% compared to the SOT23-6L was introduced today by Vishay Intertechnology, Inc. with the release of the first two ESD protection arrays in the new LLP75 package.
A new ultra-compact, leadless package that provides space savings of 25% compared to the SOT363 package and as much as 60% compared to the SOT23-6L was introduced today by Vishay Intertechnology, Inc. with the release of the first two ESD protection arrays in the new LLP75 package.

Optimized to offer excellent electrical performance and extraordinary space savings, the new GMF05C-HS3 and GMF05LC-HS3 five-diode arrays are intended for I/O line protection applications in compact and handheld products including mobile phones, notebook computers, PDAs, digital cameras, and other space-constrained electronic systems. Both new devices are specified to meet the immunity requirements of IEC 1000-4-2, offering ESD protection to 15 kV (air) and 8 kV (contact).

The GMF05C-HS3 ESD protection array released today features peak pulse current of 12 A and peak pulse power of 200 W at a 8/20 s waveform. Total capacitance for the device is 150 pF. The GMF05LC-HS3, intended for low-capacitance ESD protection, features peak pulse current of 8 A and peak pulse power of 100 W at 8/20 s waveform, with a low total capacitance value of 50 pF.

Reverse stand-off voltage of 5 V in both devices, as well as low leakage current and low operating and clamping voltages, further enhances electrical performance.

The GMF05C-HS3 and GMF05LC-HS3 are packaged in the new LLP75-6HS, a leadless plastic package with an integrated heat sink and compact dimensions measuring just 1.6 mm by 1.6 mm with a 0.7-mm height profile. Each diode array offers bi-directional protection of four I/O lines and unidirectional protection of five output lines. The new devices are specified for an operating temperature range of -55C to +125C.

Samples of the new GMF05C-HS3 and GMF05LC-HS3 are available now. Production quantities are available now, with lead times of 8 to 10 weeks for larger orders.
Bookmark and Share
 
Home I Editor's Blog I News by Zone I News by Date I News by Category I Special Reports I Directory I Events I Advertise I Submit Your News I About Us I Guides
 
   © 2012 NewMaterials.com
Netgains Logo