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News

BOC Edwards Introduces Fabsense Instrumentation Solutions

BOC Gases : 27 April, 2001  (Company News)
BOC Edwards has introduced FabSense Instrumentation Solutions, a range of cost effective, on-line instrumentation products designed for installation at key locations in a semiconductor fab to provide continuous, real-time monitoring capability. FabSense addresses the challenges of contamination control, overall equipment effectiveness and environmental safety and health.
'Our goal was to develop a range of instrumentation solutions specifically designed for semiconductor applications,' said Rob Grant, general manager-semiconductor instrumentation solutions. 'The first products to be launched in the FabSense range are designed for moisture and oxygen contamination monitoring. Trace moisture and oxygen contamination leads to oxidation, particle formation and variable layer characteristics, which directly impact yield and productivity.'

The FabSense H2O-3000 Moisture Event Sensor provides continuous, real time monitoring of UHP inert gas supplies to critical processes such as PVD, etch and epitaxy. The H2O-3000 ensures gas specification to the point-of-use, and rapidly alerts the user in the event of moisture ingress, i.e. >20 ppb moisture can be rapidly detected in, 1 minute.

Moisture and oxygen contamination within process tools can be monitored using the FabSense H2O-3000V and FabSense O2 Vac sensors. These sensors, designed for direct on-tool mounting, operate from atmospheric pressure to the ultimate vacuum of the system and provide continuous measurement of the partial pressures of moisture and oxygen in the tool environment.

As an added benefit to users, the sensors can easily be integrated into BOC Edwards FabSuite Network Monitoring Package and industry-standard SCADA Systems.

Two products in the FabSense range are currently available: FabSense H2O-3000 Moisture Event Sensor and FabSense H2O-3000V Trace Moisture Sensor. The FabSense O2 Vac sensor will be available for customer trial from July 2001.
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