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Compounds with glass bubbles to reduce part weight for RTP
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RTP Company
: 15 May, 2002 (New Product) |
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Custom compounder RTP Company, Winona, MN, has announced the availability of specialty compounds containing hollow glass microspheres which reduces part weight, enhance properties and lower part costs in demanding applications. |
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Custom compounder RTP Company, Winona, MN, has announced the availability of specialty compounds containing hollow glass microspheres which reduces part weight, enhance properties and lower part costs in demanding applications.
High loading of these microspheres, called Scotchlite Glass Bubbles manufactured by 3M, can be added to thermoplastics to reduce overall part weight, and thus per pound material costs. Additionally, they can modify polymer characteristics, achieving: lower viscosity, improved flow, and reduced shrinkage and warpage. For example, polypropylene compounds containing Scotchlite glass bubbles can have their specific gravity reduced by as much as 30 percent. The use of glass bubbles also provides more uniform control and reproducibility than other methods typically used for weight reduction, such as foaming agents.
Non-combustible and non-porous, the glass bubbles do not absorb moisture. They are able to produce stable voids, resulting in low thermal conductivity and low dielectric constants. Compounds containing Scotchlite glass bubbles are available in most engineering resins and easily adapt to common processing methods, including injection molding and extrusion. Applications that utilize this weight saving technology exist in the aerospace, automotive, marine, electronic, and medical industries. |
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