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Comprehensive PCB rework solutions from a single source

Tecan : 17 September, 2003  (Company News)
PCB rework tools can take many forms; to source them all from a single supplier has not traditionally been easy. From its diverse portfolio, established specialist Tecan offers a comprehensive selection of time and cost-saving alternatives, from mini rework stencils to reflow reflector shields.
From its extensive knowledge and technical experience, the company offers an unusually adaptable approach. In addition to the provision of specialised rework tools and accessories, it provides personalised help and advice to overcome the most demanding needs. Typical solutions currently satisfying real-life needs include dip transfer plates, mini rework stencils, BGA re-balling stencils, direct component printing stencils and reflow reflector shields.

Dip transfer plates enable the accurate application of precise flux volumes to the lower quartile of the solder balls of Ball Grid Array components, thereby eliminating excessive flux contamination on the underside of the reflowed component.

Mini rework stencils are used to replicate a single electronic device footprint to deliver accurate, consistent printed paste deposits for the finest of component pitches. Options range from simple hand-held stencils to those which need to interface with a rework station. These rework stencils assure accurate and repeatable printed results for components such as, QFP's, PLCC's, BGA's, uBGA's and SM connectors when replaced during PCB rework operations. The stencils mimic the footprints and aperture sizes corresponding to both the device and the major stencil used in the original production. In combination with a rework station, alignment is simplified, resulting in a controlled 'right first time process'.

BGA re-balling stencils offer advantages in two areas. Firstly, to ensure the precise registration of new solder spheres onto pre-printed flux deposits, and secondly, in the form of the thicker stencils necessary for printing solder paste onto the BGA itself to create new solder sphere terminations.

For depositing paste onto the pads of the BGA device itself, where the printed device will be picked and placed onto the printed circuit board and subsequently reflowed, direct component printing stencils are used.

During reflow, the company's reflow reflector shields provide critical protection for heat sensitive components on densely populated PCBs, where an adjacent device is to be reworked / reflowed. The reflow shields are custom-made to fit over leaded components such as connectors, crystal oscillators, switches, inductors and capacitors, during reflow. In the reflow oven the shield reflects heat energy, thereby preventing damage to the component body, while simultaneously allowing conducted heat from the bottom of the PCB to reflow the solder paste effectively, ensuring a good joint every time.
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