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Core module bonding solutions that meet all Smart Card application needs

3M Europe : 16 December, 2003  (New Product)
The development of smarter and greater data-rich modules has presented the smart card industry with a range of new challenges. Chief among them is the attachment of the micro modules to the broader span of plastic substrates now being exploited by the industry.
Traditionally, electronically read cards have been produced in PVC but evolution of the technology, coupled with the demand for greater durability, ever higher levels of security and enhanced aesthetics capability, has resulted in the increasing use of high tech engineering plastics that are difficult to bond and which require more sophisticated adhesive solutions.

As a technology leader in this field, 3M delivers the optimum solution, 3M Bonding Films. 3M Bonding Films are an innovative bonding solution developed specifically to meet the current and emerging needs of the smart card industry. These advanced adhesive materials satisfy the full spectrum of performance criteria. They are able to bond modules to a range of plastic cardbodies , process in existing embedding equipment and provide rapid curing.

The 3M Bonding Films family comprises high strength, curing and non-curing, electronically conductive and non-conductive technology films. Key is that they give high adhesive bond performance even with difficult to bond substrates which include PC, ABS, PET, PETg and PETf, as well as conventional materials such as PVC. Furthermore, high adhesive bond performance results in the destruction of the module when it is removed from a card, thereby giving added security to the application.

The non-conductive 3M Bonding Film grades are typically used to bond the modules in Contact Card applications such as banking, phone cards and SIM cards for mobile phones. For Dual Interface Cards, which incorporate a module and an antenna, used for public transportation passes, 3M offers Z-axis electrically conductive film. This 3Mô Bonding Film is anisotropic and simultaneously bonds the module and connects it electrically to the cardís integrated peripherals. This inherent capability saves time and cost by eliminating the need for drilling and the use of conductive paste required in traditional card construction process.

Extremely reliable and durable, this film has demonstrated outstanding mechanical properties in ISO tests involving thousands of flex movements and, moreover, its adhesive chemistry and conductive fillers ensure the maintenance of electrical connection even after thermal shock cycling and humidity ageing.
Complementing the performance profile of 3Mô Bonding Films is that all film products in this family can be used in conjunction with existing card production processes, without requiring new equipment or equipment modification.
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