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News

CuNoSS liquid abatement technology eliminates hazardous copper ions without requiring solids pre-filtration

BOC Gases : 22 September, 2006  (Company News)
BOC Edwards, a major supplier of materials, equipment and services to the semiconductor industry, has successfully completed a wastewater treatment evaluation program with STMicroelectronics, one of the world
BOC Edwards, a major supplier of materials, equipment and services to the semiconductor industry, has successfully completed a wastewater treatment evaluation program with STMicroelectronics, one of the world’s leading semiconductor manufacturers. The program demonstrated exceptional results using copper no suspended solids, an innovative liquid abatement system developed by BOC Edwards that removes copper ions (Cu2+) from copper effluents (which also contain suspended solids, oxidizers and organics).

The four-month evaluation of the copper CMP abatement technology was conducted at ST’s Rousset, France site using effluent generated by their 120nm copper process. Evaluation results showed that the BOC Edwards’ abatement solution removed copper ions from waste streams to levels below rigorous European environmental regulations without requiring solids pre-filtration. The approach proved to be cost effective and reduced overall water consumption compared to conventional copper CMP abatement technologies.

“This evaluation program was a beneficial exercise for both ST and BOC Edwards,” said Chris Case, chief technology officer at BOC Edwards. “The CuNoSS technology has proven itself in a demanding process environment, and will provide an excellent abatement solution for IC manufacturers.”

The copper ions in copper CMP effluent streams are biocides, chemical agents capable of destroying living organisms, that have strict government regulated discharge limits. The CuNoSS system utilizes proprietary fluidized bed technology (patent pending) that removes copper ions without trapping the suspended solids. This capability reduces overall wastewater treatment costs because only one solids removal system is required per fab. Furthermore, the system’s compact footprint easily fits into existing back pad facilities, which is ideal for IC manufacturers converting to copper. The abatement system is compatible with both copper CMP waste streams and copper electroplating rinse water, and is available in 15-, 30- and 45-gpm facility configurations.
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