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News

DuPont Zenite grades for improved processing and performance

Du Pont Engineering Polymers : 10 December, 2006  (Company News)
Two new grades of Zenite LCP deliver even better flow properties than typical LCPs along with other desirable property combinations required for connectors and other board-mounted electronic components. One grade, Zenite 7244, combines low warp with very high flow. The other, Zenite7140X, is well-suited for board assembly processes using lead-free solder. Its heat deflection temperature is 300
Two new grades of Zenite LCP deliver even better flow properties than typical LCPs along with other desirable property combinations required for connectors and other board-mounted electronic components. One grade, Zenite 7244, combines low warp with very high flow. The other, Zenite7140X, is well-suited for board assembly processes using lead-free solder. Its heat deflection temperature is 300C, and it has good knit-line strength and an excellent over-all balance of properties.

New Zenite 9140HT can withstand higher assembly temperatures than most LCPs, yet recommended moulding temperatures are moderate, only 10 to 15C above standard LCPs. With a heat deflection temperature of 356C, the new resin can withstand gold eutectic solder assembly and the elevated service temperatures sometimes required for coil bobbins or lamp sockets.

And finally, new Zenite ZE55801 is internally pre-catalyzed, which saves steps in the plating process. Its generally good plating performance also makes for high productivity. It is well-suited for moulded interconnects requiring plated-on circuitry and for connectors or other components plated for shielding purposes.
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