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News

ESI Group announces release of PAM-STAMP 2G 2004

ESI Group : 11 October, 2004  (New Product)
ESI Group released today at the EuroPAM conference PAM-STAMP 2G version 2004, a business value and cost-efficient sheet metal stamping simulation software. PAM-STAMP 2G includes PAM-DIEMAKER for fast design and optimization of binder surface and die-addendum, PAM-QUIKSTAMP for rapid stamping evaluation, and PAM-AUTOSTAMP for forming process validation, quality and tolerance control. Offering business value, the 2004 version has been intensively tested by ESI Group's customers in the Americas, Asia and Europe.
ESI Group released today at the EuroPAM conference PAM-STAMP 2G version 2004, a business value and cost-efficient sheet metal stamping simulation software. PAM-STAMP 2G includes PAM-DIEMAKER for fast design and optimization of binder surface and die-addendum, PAM-QUIKSTAMP for rapid stamping evaluation, and PAM-AUTOSTAMP for forming process validation, quality and tolerance control. Offering business value, the 2004 version has been intensively tested by ESI Group's customers in the Americas, Asia and Europe.

PAM-STAMP 2G 2004 introduces several new features aimed at increasing user productivity: advanced parametric re-engineering capabilities enable users to capitalize on previous experiences and to retrofit existing models; web-based reporting tools allow information sharing in a true collaborative engineering environment. Other significant enhancements include blank size optimization, robust design assessment, fast, accurate springback simulation and an improved Distributed-Parallel-Processing solver with full interoperability for multi-stage forming.

'With our new business model based on flexible tokens, our customers will have immediate access to all modules of PAM-STAMP 2G, in particular the stamp professional pack. This new version brings unmatched added value, enabling a significant step forward to answer the industry's need for full die line simulation,' said Dr Fouad El Khaldi, Product Operations Manager, ESI Group.

Several significant enhancements have been implemented in the 2004 version to improve overall ease-of-use. Web-enabled reporting tools allow sharing of information such as images, annotations, text and 3D models, thus supporting a truly collaborative engineering environment. Multi-stage and multi-project post-processing features enable users to check the entire virtual manufacturing process in one single session.

PAM-DIEMAKER's new features include projection of the flanges onto the addendum surface in order to obtain a 3D dimensional description of the trim line. Interactive binder surface modification allows for extremely flexible surface manipulation in both 2D and 3D, using an unlimited amount of sections in any direction. The new re-engineering module allows users to capitalize on previous die design experiences by reconstructing a parametric surface model based on existing tooling, and to retrofit a new part design into the parametric die model.

Users can then quickly verify tool feasibility using PAM-QUIKSTAMP: through easy set-up, the user defines all parameters and stages of the forming process for the selected press. Ready-to-use templates are available for most pressing processes and other models can be created using the Stamp Toolkit. Blank shape optimization has been improved, providing better estimation of the blank size and reducing material waste.

The die design function has been extended to support the trimming stages of a die line-up. A completely new trim process optimization module has been integrated, which can reduce the time taken to assess and optimize trimming operations. This feature can be used separately from PAM-DIEMAKER.

PAM-AUTOSTAMP's new features allow the simulation of several new process types, including flanging, double blanks, spotwelds, superplastic forming, and rubber pad forming. The 2004 version has improved drawbead modelling, now incorporating thinning and strain effects, edge effects, and a more precise lockbead. Tube hydroforming simulation provides a simplified tube bending option, as well as multistage macro templates for most common tube forming processes.

The new version of the PAM-AUTOSTAMP Distributed Memory Parallel solver offers a significant reduction in processing time which fulfills the industry requirements in terms of repeatability, data interoperability, and CPU scalability. The 2004 version includes the precise contact suitable for the springback forming process, as well as solid elements.

PAM-STAMP 2G version 2004 is available on selected Windows, Unix, and Linux hardware-vendor supported platforms.



PAM-STAMP 2G 2004 introduces several new features aimed at increasing user productivity: advanced parametric re-engineering capabilities enable users to capitalize on previous experiences and to retrofit existing models; web-based reporting tools allow information sharing in a true collaborative engineering environment. Other significant enhancements include blank size optimization, robust design assessment, fast, accurate springback simulation and an improved Distributed-Parallel-Processing solver with full interoperability for multi-stage forming.

'With our new business model based on flexible tokens, our customers will have immediate access to all modules of PAM-STAMP 2G, in particular the stamp professional pack. This new version brings unmatched added value, enabling a significant step forward to answer the industry's need for full die line simulation,' said Dr Fouad El Khaldi, Product Operations Manager, ESI Group.

Several significant enhancements have been implemented in the 2004 version to improve overall ease-of-use. Web-enabled reporting tools allow sharing of information such as images, annotations, text and 3D models, thus supporting a truly collaborative engineering environment. Multi-stage and multi-project post-processing features enable users to check the entire virtual manufacturing process in one single session.

PAM-DIEMAKER's new features include projection of the flanges onto the addendum surface in order to obtain a 3D dimensional description of the trim line. Interactive binder surface modification allows for extremely flexible surface manipulation in both 2D and 3D, using an unlimited amount of sections in any direction. The new re-engineering module allows users to capitalize on previous die design experiences by reconstructing a parametric surface model based on existing tooling, and to retrofit a new part design into the parametric die model.

Users can then quickly verify tool feasibility using PAM-QUIKSTAMP: through easy set-up, the user defines all parameters and stages of the forming process for the selected press. Ready-to-use templates are available for most pressing processes and other models can be created using the Stamp Toolkit. Blank shape optimization has been improved, providing better estimation of the blank size and reducing material waste.

The die design function has been extended to support the trimming stages of a die line-up. A completely new trim process optimization module has been integrated, which can reduce the time taken to assess and optimize trimming operations. This feature can be used separately from PAM-DIEMAKER.

PAM-AUTOSTAMP's new features allow the simulation of several new process types, including flanging, double blanks, spotwelds, superplastic forming, and rubber pad forming. The 2004 version has improved drawbead modelling, now incorporating thinning and strain effects, edge effects, and a more precise lockbead. Tube hydroforming simulation provides a simplified tube bending option, as well as multistage macro templates for most common tube forming processes.

The new version of the PAM-AUTOSTAMP Distributed Memory Parallel solver offers a significant reduction in processing time which fulfills the industry requirements in terms of repeatability, data interoperability, and CPU scalability. The 2004 version includes the precise contact suitable for the springback forming process, as well as solid elements.

PAM-STAMP 2G version 2004 is available on selected Windows, Unix, and Linux hardware-vendor supported platforms.
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