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News

Extended line of thermally conductive adhesive films

3M Europe : 01 September, 2002  (New Product)
3M's new Series 88 Adhesive Films offer enhanced thermal conductivity through the use of mineral filler material. In addition, they feature maximum surface contact for high bond strengths.
Coated with high-performance acrylic adhesive, the material is designed for bonding heat sinks to a wide variety of electronic and heat-generating components, such as IC packages and circuit boards. Permanent bonds are achieved within just seconds at room temperature and with no need for an extended curing cycle. The bond strength increases over time and with exposure to elevated temperatures. In many applications, the high dielectric strength also eliminates the need for additional insulating layers.

Thanks to the absence of a rigid carrier, the film also possesses excellent conformability to uneven or irregular surfaces. Additional mechanical fasteners, such as clips, brackets or screws, and likewise liquid adhesives, are no longer necessary. This helps save time and costs.

The new adhesive tapes come on 33m rolls in three different thicknesses, i.e. 0.13, 0.25 and 0.38mm, and in widths ranging from 50.8 to 355.6mm.
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