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News

GT Introduces Seals for Aggressive Plasma Etch Applications

Greene Tweed & Co Benelux BV : 05 September, 2006  (Application Story)
Advances in semiconductor processes and equipment have raised the bar for seals situated in aggressive dry plasma environments and higher processing temperatures. Greene, Tweed's newest compound, Chemraz 644, is an advanced perfluoroelastomer developed specifically to meet the evolving needs of the semiconductor industry for enhanced plasma resistance and minimal particulation, resulting in less downtime and higher wafer processing yields.
Advances in semiconductor processes and equipment have raised the bar for seals situated in aggressive dry plasma environments and higher processing temperatures. Greene, Tweed's newest compound, Chemraz 644, is an advanced perfluoroelastomer developed specifically to meet the evolving needs of the semiconductor industry for enhanced plasma resistance and minimal particulation, resulting in less downtime and higher wafer processing yields.

Recommended for both static and dynamic oxide etch wafer processing applications, Chemraz 644 remains stable at service temperatures up to 280C, with excursions to 300C. This material was developed to provide increased reliability in harsher processing environments. It is the ideal choice for applications with low sealing forces such as KF fitting seals, slit valve seals, chamber seals, gas inlet seals, lid seals, endpoint windows, etc.

Greene, Tweed leverages expertise in a variety of markets and products to give customers the most innovative solutions to meet performance challenges and reduce total cost of operation. With fully qualified engineering, sales and support personnel located throughout the Americas, Europe and Asia, Greene, Tweed delivers solutions to individual customer applications on a global scope. Greene, Tweed products are sold and distributed worldwide. For additional information, contact Greene, Tweed at +1.215.256.9521
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