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High temperature polyamide useful in lead-free soldering environments

DSM Engineering Plastics (Heerlen) : 08 February, 2013  (New Product)
Soldering without lead results in a higher melt temperature of the solder pastes, which in turn increases the processing temperature for soldering electronic assemblies. Stanyl ForTii can perform in up to 260C for lead-free reflow soldering of surface mount processes. The big issue of course is warpage and finding a material able to cope with the increased heat and maintain its overall stiffness and durability.
High temperature polyamide useful in lead-free soldering environments

In tests, DSM has subjected its F11 grade of Stanyl ForTii to series of tough blister tests, benchmarked against traditionally used materials, by putting several hundred connector boxes through their paces. The connector boxes had varying thickness (0.8mm to 1.6mm) and the materials were reflowed three times at 260C. Stanyl ForTii did not blister during reflow soldering and outperformed all the other halogen-free polyamides, as well as PPS, PPA and LCP.

The result is no warpage or blistering due to bad solder joints. In fact, thanks to its excellent mechanical properties, Stanyl ForTii is ideal for higher temperatures soldering in extreme temperatures even for long (DDR4) or flat (memory card) connectors.

Stanyl ForTii always meets the JEDEC 2 classification - MSL2 acc. IPC/JEDEC J-STD 020D - which allows for a one year unprotected shelf life; and the F11 grade meets JEDEC 1 in most cases (depending on the application), which allows for unlimited shelf life.

Stanyl ForTii is a high temperature, halogen free, high performance thermoplastic polyamide. The flame retardant grades are aimed at demanding applications in electronics, lighting, automotive, white goods, industrial and aerospace.

The product is also recommended for overmoulded components and sensors by replacing traditional machined-metal, multi-part, automotive sensor components like transmission speed sensors and oil level sensors. Overmoulded components, like solenoids and sensors, need materials that cope with fierce temperatures, and can be processed at low pressure - thus avoiding displacement of the electronic components. With its excellent creep resistance, Stanyl ForTii meets this need and is proven to withstand the highest temperatures long term, dealing with extreme peaks while also withstanding aggressive ATF oils.

Stanyl ForTii also meets temperature cycle tests, vibration tests at various temperatures, and long-term tests for the maintainance of a good seal against ingress of air, oil, dust, and water at elevated pressures and temperatures. This innovative technology enables the entire PCB and driving circuitry to be integrated straight into the sensor.

  • Low warpage
  • Excellent sealing between package and lead frame thanks to very high adhesion
  • Lead free SMT soldering  (260C)
  • Halogen free flame retardant V-0 at 0,2mm
  • High temperature performance
  • High mechanical strength, outperforming LCPs
  • Good adhesion to metals (no silicone encapsulation needed) outperforming LCPs
  • High elongation at break
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