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News

High temperature resistant epoxy has exceptional thermal conductivity

Master Bond : 15 September, 2004  (New Product)
Master Bond Inc. of Hackensack, New Jersey has introduced a new high performance, room temperature curing, two component epoxy adhesive/sealant called EP34AN. This compound features a thermal conductivity of 22-24 BTU/in/ft
Master Bond Inc. of Hackensack, New Jersey has introduced a new high performance, room temperature curing, two component epoxy adhesive/sealant called EP34AN. This compound features a thermal conductivity of 22-24 BTU/in/ft/hr/F. Physical properties are maintained even after long exposure to temperatures in the 400-450F range. EP34AN has superb dimensional stability and a low coefficient of expansion. It also exhibits superior electrical insulation properties.

Master Bond EP34AN has a 100 to 70 mix ratio by weight. It is easy to mix and can be applied without sagging or dripping even on vertical surfaces. The adhesive/sealant spreads smoothly and only contact pressure is required for cure. It is 100% reactive and does not contain any solvents or diluents. Cures can be accelerated by the use of heat.

EP34AN has high bonding strength to a wide range of substrates. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and most plastics is excellent. Additionally, EP34AN is resistant to thermal shock and many chemicals including water, oil and most organic solvents. It has a Shore D hardness of >85 and a tensile strength of 5,500 psi. Its tensile modulus is >500,000 psi.

Master Bond EP34AN is available for use in pint, quart, gallon and 5 gallon container kits.
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