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News

Indium Corporation will feature their RELIABILITY program at Mexitronica

Indium Corporation : 21 October, 2006  (Company News)
A key element of this program is the company's Indium5.1 Series of Pb-Free No-Clean Solder Pastes. According to Ray Altieri, Indium Corporation Market Manager, 'this series features unsurpassed print transfer efficiency through small apertures, low BGA/CSP voiding across a wide variety of reflow profiles, industry leading response-to-pause printability, and excellent wetting to all common Pb-Free metallizations.
A key element of this program is the company's Indium5.1 Series of Pb-Free No-Clean Solder Pastes. According to Ray Altieri, Indium Corporation Market Manager, 'this series features unsurpassed print transfer efficiency through small apertures, low BGA/CSP voiding across a wide variety of reflow profiles, industry leading response-to-pause printability, and excellent wetting to all common Pb-Free metallizations. These characteristics contribute strongly to our customers' finished goods reliability.'

Indium's team of experts will be available at booth # 800 to answer questions and provide information on their RELIABILITY program.

Mexitronica features the full spectrum of products and services fueling Mexico's electronics manufacturing sector. For more information visit www.mexitronica.com.

Indium Corporation is a four-time Frost & Sullivan Award-winning supplier of electronics and semiconductor packaging assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world's premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.
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