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News

Large 300mm customer demonstrates yield improvement using copper CMP slurries

Rohm & Haas Co : 12 July, 2004  (New Product)
Rohm and Haas Electronic Materials CMP Technologies, a leader and innovator in polishing technology for the global semiconductor industry, today announced that its commercially-available copper and barrier CMP slurries are being used to substantially increase yield and overall process performance in the high-volume manufacturing of advanced logic devices by a major 300mm semiconductor industry alliance group.
Rohm and Haas Electronic Materials CMP Technologies, a leader and innovator in polishing technology for the global semiconductor industry, today announced that its commercially-available copper and barrier CMP slurries are being used to substantially increase yield and overall process performance in the high-volume manufacturing of advanced logic devices by a major 300mm semiconductor industry alliance group.

This alliance has completed its conversion to the EPL2361 copper slurry and CUS1351 barrier slurry, and significantly increased overall yields at both the 120 and 90nm technology nodes by using these slurries in conjunction with Rohm and Haas Electronic Materials polishing pads and processes developed with the on-site assistance of its CMP Technologies' engineers. This combination of CMP slurries, pads and process assistance has also enabled the alliance to achieve a greater than 50 percent reduction in dishing and erosion results across all features, a substantial reduction in CMP-related defectivity, and an increase in polishing pad lifetime of more than 300 percent. The alliance has further demonstrated outstanding layer-to-layer, wafer-to-wafer, and lot-to-lot consistency due to the repeatable, predictable performance and wide overpolish window offered by these copper CMP slurries, pads and processes.

CUS1351 is a barrier CMP slurry manufactured by Rohm and Haas Electronic Materials. EPL2361 is a copper CMP slurry manufactured by Eternal Chemical Co., Ltd., a strategic alliance partner with Rohm and Haas Electronic Materials. Both slurries are commercially available through Rohm and Haas Electronic Materials.

'We are pleased with the results achieved by our customer,' said Nick Gutwein, president and CEO of Rohm and Haas Electronic Materials CMP Technologies. 'These results demonstrate that the use of our copper and barrier CMP slurries, along with our engineering support and industry-standard CMP polishing pads, can help customers substantially increase their volume manufacturing yields at 120 and 90nm technology nodes. Customers have also observed that the switchover from one production node to the other has been transparent and completely compatible from one product line to the next.'
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