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New $30 million facility Dedicated to global microelectronic materials development and integration

Rohm & Haas Co : 05 February, 2003  (Company News)
Shipley Company, L.L.C., today opened its Advanced Technology Center, a state-of-the-art facility dedicated to the development of lithography, interconnect, low-k dielectric and other critical materials needed to produce the newest generations of microelectronic devices. Shipley, a subsidiary of Rohm and Haas Company, has invested $30 million in the center as part of its ongoing commitment to deliver advanced materials capabilities to the global semiconductor market.
Dozens of industry leaders representing Shipley's customers, partners and suppliers attended the opening, along with Massachusetts State Senator Pamela Resor, Massachusetts State Representative Steven Leduc, and Marlborough Mayor William Mauro. The event also featured a series of technical poster presentations focused on Shipley's advanced lithography capabilities and the broader microelectronics materials capabilities of Rohm and Haas' Electronic Materials Business Group, a $1 billion global enterprise.

'Shipley's Advanced Technology Center is a focal point of integrated materials development, a place where Shipley can work in tandem with other Rohm and Haas companies and semiconductor equipment suppliers to resolve the IC industry's most complex materials science challenges,' said Stephen Robinson, president of Shipley Microelectronics, a division of Shipley. 'We remained committed to the ATC project throughout one of the bleakest economic periods in our industry's history, and the timing of our investment was not coincidental. We believe that this center will be a defining element in our long-term strategy to support customers as they move closer to the era of sub-100 nanometer device production.'

The new 65,000 square-foot ATC building represents the first phase of Shipley's multi-phase plans for the center. Leo Linehan, director of research and development for Shipley Microelectronics, will manage the ATC's day-to-day operations and research staff.

'Device performance and speed are increasingly tied to the successful integration of advanced new materials, which chipmakers are adopting at an unprecedented rate. The ATC will enable Shipley to deliver the technical know-how chipmakers need to integrate the wide array of new materials now under development, from advanced 193nm resists to new low-k insulators and copper ancillaries,' Linehan said.

Initial ATC programs are focused on the fast-cycle development of new 193nm photoresists and anti-reflectant coatings used in photolithographic processes. Additional programs are expected to focus on the continued development and integration of low-k dielectrics, copper interconnect and later generation lithography materials supporting 157nm, extreme ultraviolet and e-beam technologies.

The ATC's Class I cleanroom is home to one of the industry's most advanced 193nm exposure systems and the latest in track technology. The new building also includes a comprehensive metrology and modeling facility. Designed for modular cleanroom expansion, the ATC includes an additional 65,000 square feet that would enable Shipley to double the size of the facility in the future.
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