Free Newsletter
Register for our Free Newsletters
Advanced Composites
Amorphous Metal Structures
Analysis and Simulation
Asbestos and Substitutes
Associations, Research Organisations and Universities
Automation Equipment
Building Materials
Bulk Handling and Storage
CFCs and Substitutes
View All
Other Carouselweb publications
Carousel Web
Defense File
New Materials
Pro Health Zone
Pro Manufacturing Zone
Pro Security Zone
Web Lec
Pro Engineering Zone

New wafer thinning materials for semiconductor manufacturing

Honeywell Specialty Materials : 24 April, 2006  (New Product)
Honeywell today announced the availability of new 'wafer thinning materials' for semiconductor manufacturing. The new materials will be produced at Honeywell's new Electronic Materials manufacturing site in Chandler, Ariz., which opened in February of this year.
'When we announced the opening of our new facility in Chandler, we said that new customer solutions would be flowing from that operation,' said Barry Russell, vice president and general manager of Honeywell Electronic Materials. 'I am pleased to announce the availability of our new wafer thinning materials because it demonstrates delivery on that plan and our commitment to provide customized, application-specific solutions to our customers.'

Semiconductor makers use wafer-thinning material to thin the wafer substrate upon which the integrated circuits or 'chips' are built. Wafers are thinned for several reasons, including increased flexibility, allowing smaller chip packages or multiple chips packaged into the same package, and improved chip performance due to increased heat dissipation.

Increasingly, modern applications for chips require flexibility. One example is new 'smart' cards, which are credit or debit cards with embedded chips. Without adequate flexibility, the embedded chips would quickly break during normal card use. Also, as electronic devices shrink in size, they require smaller chips packages. Wafer thinning is one way of reducing the size of the package.

Finally, semiconductor manufacturers are continually seeking ways to dissipate the tremendous heat produced by today's high-powered chips. Wafer thinning materials allow chips to function at higher speeds since the insulating silicon between the device and thermal management material is reduced.

These wafer thinning materials are the first new product line from the Chandler facility. With the opening of the Chandler site, Honeywell maintains three of the newest electronic chemical facilities in the United States and boosted its capabilities to supply both straight and advanced, customized electronic chemicals for the semiconductor industry. Global supply of the new materials also will be available at Honeywell's Seelze, Germany facility.

In addition to wafer thinning materials, Honeywell will be producing other advanced wet chemicals. These solutions represent Honeywell's commitment to provide customized, application-specific product offerings to its customers with unsurpassed lot-to-lot consistency, rooted in core Six Sigma methodologies.
Bookmark and Share
Home I Editor's Blog I News by Zone I News by Date I News by Category I Special Reports I Directory I Events I Advertise I Submit Your News I About Us I Guides
   © 2012
Netgains Logo