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Osprey CE alloys meet market demands

Sandvik Coromant UK : 14 June, 2002  (Company News)
A specially formulated range of Controlled Expansion (CE) alloys produced by Osprey Metals Ltd is meeting the demands of the electronics industry for high reliability packaging solutions.
The trend towards faster and higher frequency communications means that electronic component designers face thermal, mechanical and cost barriers with existing, commonly available materials. Common thermal management materials, such as copper or aluminium, have coefficients of thermal expansion (CTE) which are higher than those of the semiconductors, resulting in unacceptable stresses and poor reliability. Other more sophisticated controlled expansion materials are limited by poor thermal conductivity, present health hazards or are prohibitively expensive for most applications.

The Osprey Metals CE alloys, developed in association with leading international users, are silicon-aluminium alloys, where the ratio of the two metal constituents can be adjusted to match the thermal expansion of microelectronic devices and substrate materials. They are true alloys, produced by Osprey's proprietary spray-forming process, and not composites prepared by powder metallurgy, which distinguishes them from Al-SiC (aluminium-silicon-carbide) and copper tungsten (Cu-W)
Key characteristics include a density less than aluminium, high thermal conductivity and high specific stiffness. The alloys are suitable for rapid CNC machining to a fine finish (Ra < 0.5 m), are platable using conventional, industry proven methods and are extremely cost competitive. Comprising a mixture of silicon and aluminium, Osprey CE alloys have excellent thermo - mechanical properties, are environmentally friendly, safe to handle and use, and present no disposal problems.

The favourable combination of properties for the Osprey CE materials means that they can be used in a wide range of applications. Uses include RF/Microwave packages, carriers and housings, electro-optical module housings and heat sinks for power modules. Other industrial applications include waveguide components, heating blocks for die bonders, components for inertial systems and injection moulding cavities.
A series of Osprey CE alloys are available with different CTE values (from 17-7ppm/C) so that the appropriate alloy can be selected to suit the application. For example, CE7 (7ppm CTE) or CE9 alloy grades are often used for high frequency type packaging whereas CE17 (17ppm CTE) can be used as a lightweight replacement for a copper substrate. Osprey CE alloys can be supplied as blocks, plates or as machined components with or without plating in in CE7, CE9, CE11, CE13 or CE17 alloy grades. Further more detailed information is available on
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