Free Newsletter
Register for our Free Newsletters
Newsletter
Zones
Advanced Composites
LeftNav
Aerospace
LeftNav
Amorphous Metal Structures
LeftNav
Analysis and Simulation
LeftNav
Asbestos and Substitutes
LeftNav
Associations, Research Organisations and Universities
LeftNav
Automation Equipment
LeftNav
Automotive
LeftNav
Biomaterials
LeftNav
Building Materials
LeftNav
Bulk Handling and Storage
LeftNav
CFCs and Substitutes
LeftNav
Company
LeftNav
Components
LeftNav
Consultancy
LeftNav
View All
Other Carouselweb publications
Carousel Web
Defense File
New Materials
Pro Health Zone
Pro Manufacturing Zone
Pro Security Zone
Web Lec
Pro Engineering Zone
 
 
 
News

Quadrant's new digital-microphotograph capacity, for optimizing machining of fine-pitch CSP test sockets

Quadrant EPP : 30 April, 2003  (New Product)
New digital-microphotography technology being developed by Quadrant Engineering Plastic products can help predict the machining characteristics of high-performance plastic board materials used to make CSP test sockets. Information from such evaluations can greatly improve test socket reliability, increase socket life and reduce device-testing costs.
In a presentation made to the 2003 Burn-in Test Socket Workshop, Mar. 4, 2003 held in Mesa, AZ, Dr. Richard Campbell, Manager of Product Development for Quadrant Engineering Plastic Products, addressed the potential benefits for applying digital-microphotography to evaluating the machining characteristics of the various high-performance plastics used to make CSP test sockets. The BiTS Workshop, sponsored by the Test Technology Technical Council of the IEEE Computer Society, is an IEEE-spon-sored workshop dedicated to providing a forum for the latest information about test sockets and related fields.

'With the aid of digital-microphotography,' says Dr. Campbell, 'various machining characteristics of high-performance plastic test sockets can be quickly and clearly observed. With this information, machining conditions can be modified to optimize productivity.'

Quadrant expects its new application development tool to be extremely useful in developing high-performance plastic grades for the next generation of fine-pitch CSP test sockets. 'Work already is underway among test-socket manufacturers,' says Dr. Campbell, 'to produce devices having 4-mil separations between holes.' Currently, commercial test-socket designs typically have a pitch of 10 mils.

In digital-microphotography, the use of a 35mm SLR camera connected to a microscope is replaced with a digital camera connected to a computer. With this arrangement, there are instantaneously viewable results, which, in the case of evaluating drilling operations for test sockets, means less time to optimize production standards.

Quadrant's digital-microphotography capacity is the latest example of its extensive experience and in?depth knowledge in semiconductor device manufacturing and testing materials. Quadrant has helped more semiconductor companies worldwide to successfully bring high-performance plastic semicon components into production, than any other plastics supplier.
Bookmark and Share
 
Home I Editor's Blog I News by Zone I News by Date I News by Category I Special Reports I Directory I Events I Advertise I Submit Your News I About Us I Guides
 
   © 2012 NewMaterials.com
Netgains Logo