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Rodel introduces new pad technology to meet increasing demands of integrated device manufacturing
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Rohm & Haas Co
: 05 March, 2003 (Company News) |
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Rodel, Inc., a leader and innovator in polishing technology for the global semiconductor industry, today announced that it has developed new pad technology that enhances polishing performance for critical chemical mechanical planarization applications. The FBP3100 CMP polishing pad was developed to meet the tighter performance specifications of IC manufacturing, while also providing productivity enhancements. |
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Rodel, Inc., a leader and innovator in polishing technology for the global semiconductor industry, today announced that it has developed new pad technology that enhances polishing performance for critical chemical mechanical planarization applications. The FBP3100 CMP polishing pad was developed to meet the tighter performance specifications of IC manufacturing, while also providing productivity enhancements.
'Device makers need new and innovative CMP consumable technologies in order to enhance the evolving polishing process,' said Catherine Markham, director of pad technology for Rodel. 'The FBP3100 polishing pad achieves this with lower cost of ownership benefits, increased performance and excellent defectivity, helping device manufacturers to address a variety of complex CMP applications.'
Targeted for volume production processes, the FBP3100 delivers low defectivity results while maintaining topographical control. The polishing pad offers tighter thickness control and improved dishing and erosion performance over traditional pads. End point detection is integrated with the pad to increase performance and provide a predictable polishing environment. In addition, the FBP3100 incorporates a standard XY groove pattern, which can be customized for specific application needs. Slurry flow on the FBP3100 can be decreased without impacting the removal rate or within-wafer non-uniformity percent in tungsten polishing applications, allowing users to reduce the overall cost of ownership for the polishing step.
The FBP3100 pad can be used in the same applications as the Politex Prima finishing pad, which was recently introduced as an enhancement to Rodel's existing Politex pad technology. The FBP3100, however, is ideal for more advanced applications, providing users with increased performance.
To learn more about the FBP3100 CMP polishing pad, please visit Rodel in booth #1321, Hall 1, during SEMICON China 2003, being held March 12-14 at the Shanghai New International Expo Center, Shanghai, China. |
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