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News

Rodel partners with Kinik to co-develop and market CMP pad conditioners

Rohm & Haas Co : 11 September, 2000  (Company News)
Rodel, Inc., the market leader in consumable systems and processes for chemical mechanical planarization of semiconductor devices, semiconductor substrates and memory devices, today announced it has signed an agreement with Kinik Company to co-develop CMP pad conditioners and serve as the company's global market channel for its pad conditioners.
Kinik, a leading Taiwanese developer and manufacturer of CMP pad conditioners and other advanced diamond products, successfully introduced the pad conditioners under the DiaGrid(TM) product name last year in Taiwan, Korea and Japan.

``We expect this alliance to substantially increase existing market share and profitability for both companies. The partnership builds upon our expertise in CMP processes and our leading global presence in the CMP consumables markets,'' said Tony Khouri, president and chief executive officer of Rodel. ``Rodel continues to make investments that demonstrate its commitment to delivering the industry's best CMP process technology solutions and unparalleled customer service.''

Already in production, the Rodel DiaGrid(TM) pad conditioners have demonstrated enhanced removal rate stability, improved uniformity of removal rate and reduced defectivity, when compared to competing products in customer testing. Protected by a layer of proprietary DiaShield(TM) coating, the Rodel DiaGrid pad conditioners can be used in acid slurries and condition the pad in-situ, particularly important for metal CMP processes such as next-generation copper technology. According to customer data, Rodel DiaGrid pad conditioners can reduce cost of ownership, increase production throughput and improve the quality of the polished wafer.

Frank S. Lin, president of Kinik, commented, ``We are excited about the link we have created between Rodel's CMP technology and our diamond conditioners' superiority. We believe the control and optimization of pad-conditioner interface will have a large impact on future CMP technology. Our goal is to make Rodel DiaGrid pad conditioners the world standard for CMP processes.''

Rodel's advanced testing capabilities will accelerate product development and characterization and provide documentation to assist end-users in their testing and qualification processes. Kinik's proprietary diamond placement technique is uniquely capable to prevent diamond pull outs and to optimize the pad conditioning performance. The results are sustained polishing rates with improved wafer yields.
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