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Single source for high performance hybrid package lids

Tecan : 24 June, 2006  (New Product)
Critical to the success of manufacturing semiconductor and optoelectronic hybrid packages are their lids, which must be highly accurate and exact fits, to ensure electromechanical integrity. Traditionally, manufacturers of hybrid packages, or tubs, buy the lids separately and may have to use more than one sub-contract source for specialized finishing, such as electroplating. The time and logistical problems associated with these supply methods have now been solved by single-source specialist, Tecan.
The company offers the electronics industry a single centre of excellence for the supply of these critical components, negating the need for tub manufacturers to use more than one source for their lids. From its specialist facility the company supplies exact-fit highly-accurate burr and stress free lids to meet the most demanding individual needs.

Tecan is believed to be the only company able to provide all necessary manufacturing techniques under one roof, which is fundamental in ensuring the most consistent and repeatable quality available, for either flat or stepped lids. Electroplating, a crucial aspect of manufacture, is performed in-house and carefully quality controlled to ensure accuracy and repeatability. So comprehensive is the service, that lids can be produced without manufacturing 'tags' or 'witness marks' assuring the absolute uniformity necessary for accurate bonding to the recipient hybrid tub.

Highly-accurate and proven photochemical machining techniques are used by Tecan to fabricate the precision parts. The process also brings other value-added benefits at no extra cost - for example, part numbers, company contact details and other data can be readily etched onto the lid. Typical materials include nickel alloys such as Kovar, Dilver P and Olin 194, other materials are available on request. The company's in-house electroplating processes encompass all expected finishes - from electroless nickel, to hard-acid gold and pure-soft gold.

Lid solutions for all volume levels and specifications can be supplied by the single-source company, with rapid prototyping available on a five-day turnaround. Tooling costs are low compared to other methods of manufacture and modifications can be quickly and cost-effectively accommodated. The company operates a strict ISO9002 manufacturing regime and can readily manufacture to military specifications.

Hybrid packages are used in the most demanding electronics and microwave applications, for example - in surface acoustic wave SAW devices, which are playing increasingly important roles in all end-user industries, particularly in aerospace, defence and telecoms.
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