Free Newsletter
Register for our Free Newsletters
Newsletter
Zones
Advanced Composites
LeftNav
Aerospace
LeftNav
Amorphous Metal Structures
LeftNav
Analysis and Simulation
LeftNav
Asbestos and Substitutes
LeftNav
Associations, Research Organisations and Universities
LeftNav
Automation Equipment
LeftNav
Automotive
LeftNav
Biomaterials
LeftNav
Building Materials
LeftNav
Bulk Handling and Storage
LeftNav
CFCs and Substitutes
LeftNav
Company
LeftNav
Components
LeftNav
Consultancy
LeftNav
View All
Other Carouselweb publications
Carousel Web
Defense File
New Materials
Pro Health Zone
Pro Manufacturing Zone
Pro Security Zone
Web Lec
Pro Engineering Zone
 
 
 
News

Temperature and current-sensing TrenchFETs in thermally enhanced D2PAK package

Vishay Electronic : 16 August, 2002  (New Product)
Siliconix incorporated, an 80.4%-owned subsidiary of Vishay Intertechnology, Inc., today announced the introduction of seven new temperature- and current-sensing TrenchFETs, including the industry's first 75-V current-sensing MOSFET, in a thermally enhanced D
The new 30- to 75-V TrenchFETs are designed for any application requiring temperature or current sensing, such as motor drives and valve drives, as well as industrial and automotive applications including door modules, EPS, and 12-V or 42-V Powernet systems in cars.

The temperature-sensing function of the new SUM Series devices can be used to allow the MOSFET to shut down circuitry before extreme temperature causes circuit malfunction or damage. Likewise, the current-sensing diode allows the MOSFET to shut down circuitry when it detects excessive current, as in the case of a stalled motor or short circuit.

Like preceding devices in the Vishay Siliconix 'SUM' series, these new power MOSFETs are provided in an enhanced D≤PAK with a proprietary leadframe design that allows the devices to offer the industry's lowest thermal resistance for this package type, depending on the die-size used.

With no increase in footprint, the new TrenchFETs provide thermal resistance up to 33% lower than standard D≤PAK packages, as well as up to 20% higher current-handling capability, up to 50% higher power dissipation, and maximum on-resistance ratings as low as 4.5 mΩ. As a result, these new TrenchFETs can handle higher current and more power, or run cooler while handling the same amount of current and power.

Higher current-handling capability and lower on-resistance values allow designers to save board space and lower production costs because in some cases fewer MOSFETs need to be run in parallel to reach the required current level and power load for a given application. By eliminating one or more MOSFETs, designers can reduce component, assembly, and testing costs.

Samples and production quantities of the SUM50N03-13LC, SUM60N04-12LT, SUM60N04-05LT, SUM60N04-06T, SUM60P05-11LT, SUM60N08-07C, and SUM60N08-07T are available now, with lead times of 10 to 12 weeks for larger orders.
Bookmark and Share
 
Home I Editor's Blog I News by Zone I News by Date I News by Category I Special Reports I Directory I Events I Advertise I Submit Your News I About Us I Guides
 
   ¬© 2012 NewMaterials.com
Netgains Logo