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News

Thermal conductive adhesive has convenient one to one mix ratio

Master Bond : 02 February, 2004  (New Product)
Master Bond EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive with a forgiving 1 to 1 mix ratio by weight or volume. Developed by Master Bond Inc., Hackensack, N.J. this compound is extremely versatile and will adhere well to variety of similar and dissimilar substrates. It has a low coefficient of expansion, low shrinkage and superb dimensional stability. It also exhibits superior durability and chemical resistance.
Master Bond EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive with a forgiving 1 to 1 mix ratio by weight or volume. Developed by Master Bond Inc., Hackensack, N.J. this compound is extremely versatile and will adhere well to variety of similar and dissimilar substrates. It has a low coefficient of expansion, low shrinkage and superb dimensional stability. It also exhibits superior durability and chemical resistance.

EP21AO is easy to apply and is a self leveling paste. It is 100% reactive and does not contain any solvents or volatiles. It has a thermal conductivity of 10BTU/in/ft/hr/F and a dielectric strength of >400 volts/mil. Its volume resistivity is >10 ohm cm. EP21AO has a Shore D hardness of >85 and a tensile strength of 5,000psi. Service operating temperature range is -60F to +250F.

Master Bond EP21AO is available for use in pint, quart, gallon and 5 gallon container kits.
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