Free Newsletter
Register for our Free Newsletters
Newsletter
Zones
Advanced Composites
LeftNav
Aerospace
LeftNav
Amorphous Metal Structures
LeftNav
Analysis and Simulation
LeftNav
Asbestos and Substitutes
LeftNav
Associations, Research Organisations and Universities
LeftNav
Automation Equipment
LeftNav
Automotive
LeftNav
Biomaterials
LeftNav
Building Materials
LeftNav
Bulk Handling and Storage
LeftNav
CFCs and Substitutes
LeftNav
Company
LeftNav
Components
LeftNav
Consultancy
LeftNav
View All
Other Carouselweb publications
Carousel Web
Defense File
New Materials
Pro Health Zone
Pro Manufacturing Zone
Pro Security Zone
Web Lec
Pro Engineering Zone
 
 
 
News

TMP and BASF to jointly develop electronic materials for copper and barrier CMP-slurries

BASF Aktiengesellschaft : 08 May, 2006  (New Product)
TMP and BASF announced today that they have entered into a license and joint development agreement for copper and barrier CMP-slurries (CMP, Chemical Mechanical Planarization). This agreement will leverage TMP's leading technological position and BASF's expertise in nanotechnology, product development and global marketing and distribution. Under the agreement, BASF will manufacture and distribute these slurries to customers based outside of Japan, who are within the key markets for semiconductor materials. Further developments of the licensed products will be performed jointly with TMP.
TMP and BASF announced today that they have entered into a license and joint development agreement for copper and barrier CMP-slurries (CMP, Chemical Mechanical Planarization). This agreement will leverage TMP's leading technological position and BASF's expertise in nanotechnology, product development and global marketing and distribution. Under the agreement, BASF will manufacture and distribute these slurries to customers based outside of Japan, who are within the key markets for semiconductor materials. Further developments of the licensed products will be performed jointly with TMP.

The new agreement is a significant expansion of BASF's activities in the electronic materials markets and targets the highly innovative area of copper and barrier CMP-slurries. These are important process chemicals for the planarization of silicon wafers. The two companies will jointly focus on product - and hence customer process - improvements by combining BASF's chemical and nanotechnology expertise and market knowledge with TMP's application and product know how.

'TMP and BASF intend to leverage their combined expertise in copper- and barrier CMP-polishing and chemistry aimed at system innovations for the semiconductor industry,' said Takehisa Ohkawa, chief executive of TMP.

'We look forward to addressing our customers with our strengthened CMP-portfolio and to find the right solution for their polishing needs in order to help them to be more successful,' said Dr. Karl-Rudolf Kurtz, Group Vice President of BASF's global business unit Electronic Materials. 'TMP has a well-established track record of developing and applying copper and barrier CMP-slurries to customers in the Japanese home market. Through this license and joint development agreement, TMP and BASF will benefit twofold: by combining TMP's products with BASF's global customer reach as well as joining TMP's application know-how with BASF's very broad chemical expertise', stated Kurtz.
Bookmark and Share
 
Home I Editor's Blog I News by Zone I News by Date I News by Category I Special Reports I Directory I Events I Advertise I Submit Your News I About Us I Guides
 
   © 2012 NewMaterials.com
Netgains Logo