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News

TrenchFETs in new thermally enhanced D2PAK package save board space and lower costs

Vishay Electronic : 25 March, 2002  (New Product)
Seven new power MOSFETs in a thermally enhanced D2PAK package, which enables a record-low level of thermal resistance and is capable of handling 29% more current than the conventional D2PAK, were announced today by Siliconix incorporated, an 80.4%-owned subsidiary of Vishay Intertechnology.
Seven new power MOSFETs in a thermally enhanced D2PAK package, which enables a record-low level of thermal resistance and is capable of handling 29% more current than the conventional D2PAK, were announced today by Siliconix incorporated, an 80.4%-owned subsidiary of Vishay Intertechnology.

The new n-channel 40- to 200-V TrenchFETs are designed for use in automotive and communications applications, including motor control, ABS, electric power steering, and 12 and 42-V Boardnet applications in cars, and for primary-side switching in the isolated dc-to-dc converters used in servers, routers, and networks.

Vishay's new thermally enhanced D2PAK incorporates a proprietary leadframe design that allows devices in the 'SUM' series to offer the industry's lowest thermal resistance for this package type, depending on the die-size used. Compared with conventional D2PAK devices, the new SUM series offers up to 29% higher maximum current of 110 A, 75% higher power dissipation of up to 437.5 W, and on-resistance as low as 2.3 m. Thermal resistance is as low as 0.4 C/W - 33% lower than in standard D2PAK devices. As a result, the devices can handle higher current and more power, or run cooler while handling the same amount of current and power.

Higher current-handling capability and lower on-resistance values allow designers to save board space and lower production costs because it's possible to run fewer MOSFETs in parallel to support the required current level and power load for a given application. By eliminating one or more MOSFETs, designers can reduce component, assembly, and testing costs.

In addition to superior current-handling and power dissipation capabilities, select D2PAK TrenchFETs in the SUM series feature a maximum junction temperature as high as 200C, an improvement of as much as 14% in the standard D2PAK footprint.

Samples and production quantities of the SUM110N04-02L, SUM110N04-03, SUM110N06-04L, SUM110N08-05, SUM110N10-09, SUM85N15-19, and SUM65N20-30 are available now, with lead times of 10 to 12 weeks for larger orders.
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