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News

Vishay expands IHLP family of low-profile, high-current inductors with new devices

Vishay Electronic : 20 August, 2006  (New Product)
Vishay Intertechnology, Inc. today announced that it is extending its IHLP family of low-profile, high-current inductors with new devices in the 2525-size footprint offering inductance values from 10
Vishay Intertechnology, Inc. today announced that it is extending its IHLP family of low-profile, high-current inductors with new devices in the 2525-size footprint offering inductance values from 10 H down to 0.56 H.

With the lowest DCR/H for their respective package sizes, the new IHLP inductors serve as high-performing, space- and power-saving solutions for voltage regulator module and dc-to-dc converter applications in end products including next-generation mobile devices; notebooks, desktop computers, servers, graphic cards, portable gaming devices, personal navigation systems, personal multimedia devices, and automotive systems; low-profile, high-current power supplies and point of load converters; distributed power systems; and field-programmable gate arrays.

The IHLP-2525EZ-01 inductors measure 0.255 in. by 0.270 in. [6.47 mm by 6.86 mm] with a maximum height profile of 0.197 in. [5.0 mm]. They occupy the standard 2525 footprint shared by lower-profile IHLP devices while providing higher rated current and lower DCR values.

The new devices are specified for saturation currents ranging from 4.5 A to 12 A, typical DCR values ranging from 3.4 m to 67.9 m, and maximum DCR values ranging from 3.6 mΩ to 71.3 mΩ. Standard inductance tolerance is 20 %.

Like other devices in the IHLP family of high-current inductors, the IHLP-2525EZ-01 devices handle high transient current spikes without hard saturation and operate at a frequency under 1MHz. Packaged in an RoHS-compliant, 100 % lead (Pb)-free shielded, composite construction that reduces buzz noise to ultra-low levels, the new devices are specified for an operating temperature range of −55 C to +125 C with high resistance to thermal shock, moisture, mechanical shock, and vibration.
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