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News

Vishay launches new thin film resistor networks

Vishay Electronic : 22 June, 2001  (New Product)
Vishay Intertechnology, Inc today announced the release of the MPD, a new series of isolated matched pair resistor networks in the SOT-143 industry-standard package. The new thin film devices will allow designers to replace pairs of discrete resistors with a single-package device where two precision-matched resistors are integrated onto a common silicon substrate. Providing near-identical conditions over time and temperature for each element, the new MPDseries will improve end product performance while reducing component count and saving space with a surface-mount package measuring just 2.8 mm by 2.10 mm with a maximum 1.22 mm height profile.
Vishay Intertechnology, Inc today announced the release of the MPD, a new series of isolated matched pair resistor networks in the SOT-143 industry-standard package.

The new thin film devices will allow designers to replace pairs of discrete resistors with a single-package device where two precision-matched resistors are integrated onto a common silicon substrate.

Providing near-identical conditions over time and temperature for each element, the new MPDseries will improve end product performance while reducing component count and saving space with a surface-mount package measuring just 2.8 mm by 2.10 mm with a maximum 1.22 mm height profile.

Built on Vishay's Thin Film technology, devices in the MPD series integrate pairs of resistive elements with standard values of 1 kΩ, 2 kΩ, 5 kΩ, or 10 kΩ available from stock.

The typical temperature coefficient is 25 ppm/C with a close tracking temperature coefficient ratio of just 2 ppm/C. Available absolute tolerances range from 0.1% to 1.0%. An extended -55C to +125C operating temperature range ensures exceptional stability even in extreme environments.

Provided in tape-and-reel or waffle pack form, samples and production quantities of the MPDseries resistor networks are available now, with lead times of stock to eight weeks.
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